Advanced RF System-in-Package for Cell Phones 2017

Yole Développement

The transition from 4G to 5G requires disruptive packaging innovation. 5G mmWave, 5G sub 6 GHz – which packaging architectures can rise to the occasion



  • Market overview
  • Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz
  • Disruptions and opportunities thereof
  • Focus on FEM and PAM architectures in RF Front-End of cellphones
  • RF Front End SiP forecast (Revenue, Wafers, Units
  • Technology trends and forecast
  • RF Front-End multi-die System-in-Package challenges and technology requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands
  • 5G SiP packaging roadmaps for smartphone Front-End
  • RF SiP Revenue, Wafer and Unit forecasts
  • Supply chain analysis
  • Supply chain changes in the new 5G era
  • Strategies and outlook of current RF SiP manufacturers
  • New entries and supply chain disruptions for mmWave packaging



This report’s objectives are to:

  • Translate 5G market drivers to semiconductor packaging dynamics
  • Summarize multi die packaging (SiP) technology challenges and requirements for RF Front-End in smartphones
  • Analyze various developing RF SiP architectures for sub 6 GHz and mmWave frequencies, advantages and suitability thereof
  • Analyze supply chain changes and opportunities for 5G in smartphones

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