AMD Ryzen 5 Pro SoC Central Processing Unit

System Plus Consulting

System-on-chip mobile processor using TSMC’s 7nm process technology with multiple layers of MIM capacitor material embedded between the die metal layers.

Complete teardown with:

  • Detailed photos
  • Precise measurements
  • Materials analysis
  • Floorplan
  • 3D X-ray images
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis

Cet article vous a plu ?

Partagez-le sur vos réseaux sociaux