Apple iPhone 6s Plus Teardown & Physical Analyses of Key Components

System Plus Consulting

Discover and understand Apple’s technical choices and main suppliers



  • Smartphone Teardown
  • ICs identification (manufacturer, reference, function, package type, size, pitch & pin count)
  • ICs Silicon Area (dies size)
  • PCB Characteristics (cross-section, min. line width)
  • Physical Analyses (decap-sulation, cross-section, optical & SEM pictures, measurement)

Cet article vous a plu ?

Partagez-le sur vos réseaux sociaux