Automotive Packaging: Market and Technologies Trends 2019

Yole Développement

Vehicle autonomy and electrification are encouraging advanced packaging’s growth in this industry.

What’s new

  • Detailed packaging forecast, by application; detailing the package by device for each application
  • CIS packaging forecast, by CIS type
  • LiDAR packaging forecast, by device type (laser, photodetector, μmirror)
  • Radar and connectivity packaging forecast, by device type
  • Automotive computing application (ADAS computing and AI for infotainment)
  • Automotive memory (DRAM, NAND) applications • IDMs and OSATs – 2018 packaging market share, and vision for 2024
  • Supply chain changes – three different scenarios

Key features

  • Automotive market overview and trends • Automotive packaging, trends, changes, challenges
  • Multiple automotive applications: CIS / LiDAR / radar / connectivity / MEMS and sensors / memory / computing / power / LED
  • Forecast (units and revenue) by packaging type for each application
  • Supply chain and ecosystem by application
  • IDMs and OSATs automotive packaging market share

Report objectives

  • Offer a global overview of the automotive market and trends
  • Show the impact of automotive mega-trends, and trends in the automotive semiconductor ecosystem
  • Provide an overview of automotive electronics and packaging
  • Furnish updated market data & forecasts for different automotive applications, and their packaging (units and revenue): CIS / LiDAR / radar / connectivity / MEMS and sensors / memory / computing / power / LED
  • Identify the key players and their automotive ecosystems
  • Discuss the possible scenarios for the automotive supply chain’s future evolution
  • Compare the packaging market share of IDMs vs. OSATs

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