As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
Key features of the monitor
- Quarterly update of the data
- Market forecast through 2024 in $US, units, and wafers
- Market share (Sony, Samsung, OmniVision, ON Semiconductor, STMicroelectronics, Panasonic, Canon, SK Hynix) from 2015 to present: by revenue ($US), segment ($US), technology (wafer), and foundry (wafer)
- Demand forecast through 2024 by category (i.e. mobile, consumer, security, auto), in revenue ($US) and units
- Supply forecast through 2024: by supplier for wafer production (wpm, by fab), technology mix (% of wafers), and process node (% of wafers)
This monitor is not part of our Bundled Offer and Full Yole Développement yearly subscription.
Table of contents
CIS market overview
- CIS market dynamics
- Quarterly revenue: Near term
- Quarterly revenue: Long term
- CIS market share
CIS market demand
- CIS market demand overview
- CIS market segment share
- Mobile market
- Consumer market
- Computing market
- Automotive market
- Medical market
- Security market
- Industry market
- Aerospace & Defense market
- CIS wafer demand, per segment
- Per technology (VIS and NIR)
- Shipments by technology node (XX nm)
- Shipments by technology (FSI x BSI x Stack BSI x Multi-Stack)
- Industry wafer production (CIS wafer production, per foundry – Long/near term – VIS and NIR)
- Industry wafer capacity estimation
- Sony – Revenues per quarter and per application, capacity, fab.
- Samsung – Market mix
- OVT – Market mix
- ON Semiconductor – Market mix
- STMicroelectronics – Market mix
- Panasonic – Market mix
- Canon – Market mix
- SK Hynix – Market mix
- Others – Market mix
CMOS IMAGE SENSOR (CIS) HAS BECOME A KEY SEGMENT IN SEMICONDUCTOR INDUSTRY
CIS is an analogic variant of the CMOS process commonly used for memory and logic circuits, and has become a key segment in semiconductor, reaching $15.5B in 2018 and exceeding 3% of total semiconductor sales. This segment has seen Sony become a significant semiconductor player, alongside other CIS players such as Samsung, OVT, and ON Semiconductor. Innovative approaches like wafer stacking technologies have emerged specifically for CIS, and have become key developments for the semiconductor market in general. In the context of a fierce rivalry in the technology sector, imaging has become a key focal point of OEMs and the entire semiconductor supply chain.
Yole Développement will begin publishing, in quarterly instalments, a monitor containing world-class research, data, and insights pertaining to the imaging markets. This monitor will analyse the CIS markets’ evolution in terms of revenue, shipments, capex, and near-term price evolution, as well as demand per market segment and CIS technology evolution. NIR sensing is also included in this quarterly imaging monitor, as well as detailed profiles of main suppliers. In the future, Yole Développement will extend its coverage to key components of the imaging market.
IMAGE SENSOR ATTACHMENT RATES ARE INCREASING, THANKS TO MOBILE PHOTOGRAPHY
In 2007, smartphones began disrupting the imaging market and its corresponding technology. Just five years later, the production peak for digital still-cameras was reached, and phones became the primary imaging device for consumers. New use-cases linked to social media began fuelling the need for high-quality rear (world-facing) cameras for photography, quickly followed by front (selfie) cameras for videos and top-grade photography. 2015 – 2017 saw additional cameras attached, either to extend the zoom capability on the rear or to provide 3D biometric interaction on the front. In 2019, 3D rear cameras are pushing the trend further to the back, improving the photographic experience and making inroads into augmented reality (AR) applications.
In 2019, the overall attachment rate for CIS cameras per phone is moving towards in average of 2.5 units per phone, and the growth rate for CIS attachment will rise from 6.5% to 7.8% from 2019 – 2021. Amidst stagnant smartphone volume, CIS attachment rate is a central, successful strategy for main smartphone OEMs like Apple, Huawei, and Samsung.
Alongside mobile, which is the main application market (representing 70% of all CIS sales), security and automotive are experiencing double-digit growth and have grown into billion-dollar CIS segments. Again, the attachment rate per endsystem is the key metric to monitor.
The CIS market’s future promises to be as dynamic as its past. Yole Développement’s quarterly monitor will answer the pressing questions facing this industry, including:
- Will the three primary CIS (Sony, Samsung, and OVT) continue to manage supply and drive industry revenue to even higher levels?
- Will the 3D sensing trend help STMicroelectronics and Infineon join the leading pack?
- Will China’s entrance in the CIS market disrupt the current market balance?
- What demand segments will emerge to compensate for the diminishing computing and consumer categories?
- How much farther will the CIS roadmap extend? Is there a future beyond hybrid stacking?
- How will AI and machine learning impact CIS demand and the technology roadmap?
- Will autonomous vehicles meaningfully impact the CIS market? If so, when?
- Will CIS capital expenditures continue their recent upward trend, or will capital intensity climb too high and threaten supplier stability?
WHAT DO THE UPCOMING QUARTERS HOLD?
2019 looks slightly different than 2018. With a low Q1, the CIS market faces a slowly eroding ASP since most players can now match Sony’s proposition. Nevertheless, the market remains constrained in terms of capacity, with capex the main limiting factor since customers always want more CIS cameras. The outlook though remains very positive – in the range of 10% YoY in 2019 and 8% over the long-term – CIS is heading for $24B in 2024.
New increases in resolution (16Mp and beyond 20Mp) are linked to new progress in pixel size, but momentum is slow in the 0.8um pixel size range. The consequence is increased die size and silicon. CIS wafer volumes are approaching 250kWpm and will climb to 350kWpm before 2024, necessitating more CIS manufacturing lines to be created or converted from regular CMOS lines.
CIS QUARTERLY MARKET MONITOR – CONTENT
The CIS Quarterly Market Monitor contains all of the data related to CIS revenue per quarter, CIS shipments, near and long-term revenue, market share per quarter, capex per company, and market demand/supply forecasts, as well as a complete analysis and details of the demand side, with a deep dive into mobile, consumer, computing, automotive, medical, security, defense & aerospace, and industrial. For the top players (Sony, Samsung, OVT, ON Semiconductor, STMicroelectronics, Panasonic, Canon, SK Hynix, and others), the CIS Quarterly Market Monitor furnishes a detailed analysis of capex, shipments, and wafer production per technology (process mix), along with the expected impact of CIS technology changes.
The following deliverables are included:
- Excel database with quarterly update on historical and forecast data
- PDF slide deck with graphs and comments/ analysis covering expected evolutions
- Direct access to a Yole Développement analyst for one year, including opportunities for an on-demand Q&A as well as discussions regarding trends, analyses, forecasts, and breaking news.
WHAT ABOUT THE IMAGING RESEARCH?
A full package:
The CMOS Image Sensor Quarterly Market Monitor includes the following deliverables:
- Excel database with quarterly update on historical and forecast data
- PDF slide deck with graphs and comments/analysis covering expected evolutions
- Direct access to a Yole Développement analyst for one year, providing an opportunity for on-demand Q&A and discussions regarding trends, analyses, forecasts, and breaking news
Receive every quarter the updated Market Monitor documents
Canon, OVT, ON Semiconductor, Panasonic, Samsung, SK Hynix, Sony, STMicroelectronics and more…
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