Die Attach Equipment Market 2019

Yole Développement

Growing business and new technical challenges are ensuring consolidation of the die attach equipment market.

 

Key features of the report

  • Market and technology trends in the die attach equipment market
  • Die attach equipment business investigations through various segmentations:
    • By bonding technologies, such as mass reflow, TCB, eutectic, solder, sintering, epoxy, hybrid bonding
    • By different device applications, such as logic, memory, RF, MEMS, CIS, discrete, LED, optoelectronics/photonics
  • In depth analysis of the die bonder and flip-chip bonder market
  • Comprehensive list of die attach equipment suppliers with over 70 companies identified
  • Technological roadmap and benchmarking of the equipment covering various devices and technologies
  • Supply chain analysis: overview of the key equipment suppliers across various segments along with the installed base at their customers
  • Merger and acquisition trends in the die attach equipment business
  • Competitive landscape of key tool suppliers

 

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