Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.
Key features of the report
- Overview of the main applications for discrete power devices, along with their drivers and future trends
- Analysis of each packaging component, along with forecasts and future technology development
- Examination of the discrete power-device supply chain (devices and packaging components)
- Review of the shifting business models, synergies with other industries, and opportunities for newcomers in discrete power devices
Objectives of the report
- Provide an overview of the main applications for discrete power devices, along with their drivers and future trends
- Discuss the impact of application trends on package design and packaging materials
- Furnish an analysis of each packaging component, along with forecasts and future technology development
- Offer an overview of the discrete power device supply chain (devices and packaging components)
- Analyze the shifting business models, synergies with other industries, and opportunities for newcomers in discrete power devices
Table of content
Report objectives 4
About the authors 7
Companies list 8
Executive summary 9
Market forecast 39
- Discrete power device market, in million units – Split by device type
- 2018 – 2024 share evolution in discrete power devices (in Munits)
- Discrete power device market, value in $M – Split by device type
- 2018 – 2024 share evolution in discrete power devices (in $M)
- 2018 – 2024 market value for packaging materials (in $M) – By device type
- 2018 – 2024 market value for packaging materials (in $M) – By packaging solution
- 2018 – 2024 market value for leadframe (in $M)
- 2018 – 2024 market value for encapsulation (in $M)
- 2018 – 2024 market value for die attach (in $M)
- 2018 – 2024 market value for interconnections (in $M)
Market trends 54
Technology trends 85
- Discrete power devices
- Global packaging trends for power devices (discrete devices and modules)
- Global packaging trends for discrete power devices
Technology trends – Package type 106
- Discrete device package – Case studies
- SiC and GaN power device packaging
Discrete power device – Packaging solutions 143
- Technology trends – Leadframe
- Technology trends – Electric interconnections
- Technology trends – Die attach
- Technology trends – Encapsulation
Supply chain 178
Yole Développement corporate presentation 199
DISCRETE POWER DEVICE PACKAGING: A BIG, SLOW-GROWING MARKET REACHING $3.7B BY 2024
Discrete power devices (rectifiers, MOSFETs, IGBTs, bipolar transistors, and thyristors) represents an established, mature market with a value of about $13.5B in 2018 and an expected 2018 – 2024 CAGR of 2.9%. Amongst the discrete power device industry’s key characteristics and needs are low cost per device, a large selection of products and suppliers, and use of proven, highly standardized products and technologies, including packaging technologies. In fact, the packaging technologies for discrete power devices (leadframe, die attach, electrical interconnections, and encapsulation) should have the aforementioned characteristics. It is difficult to match the highvolume, standardized products and low cost required by device integrators with the acceptable additional costs equated to innovative packaging technologies.
Market growth and market size for different packaging solutions is the complex result of many different variables, including device demand evolution, die size, package type and interconnection method used, device size following downsizing trends, semiconductor content per packaged device, and more. Some of these factors favor a market increase, others a market decrease, participating in a rather flat market evolution. According to Yole Développement’s analysis, the discrete power packaging market’s evolution will remain pretty flat, but continue to grow at a 2018 – 2024 CAGR of 1.1%. Global discrete power device packaging will reach $3.7B by 2024.
As shown in this report, major changes in packaging solutions will be realized on the electrical interconnections level, due to the growing adoption of copper clips as a substitute for more conventional wire and ribbon bonding. The interconnections market will grow at a 2018 – 2024 CAGR of 2.5%.
PACKAGING INNOVATORS’ FOCUS IS MOVING AWAY FROM DISCRETES
The choice of packaging solutions and semiconductor die are increasingly interlinked. The adoption of wideband- gap semiconductor die technologies (SiC and GaN) brings new hope to developers of innovative packaging solutions (high-temperature epoxy, low-inductance electrical interconnections, silver sintering die attach, etc.) willing to commercialize them. However, most technological development in silicon, SiC, and GaN power device packaging is focused on other device types which by definition do not belong to the category of discrete devices: these include power modules and integrated devices like system-on-chip (SoC) and system-in-package (SiP). In these devices, the package holds much greater importance than in discrete devices. Developers of innovative packaging solutions focus on these devices because of stronger requirements, higher added-value for customers, and stronger differentiating value compared to competitors’ products.
The progressive transition from discrete SiC towards SiC modules in EV/HEV applications, the embedded-die packaged systems, and the integration of GaN devices in multichip systems are just a few examples of such trends. Although the adoption of wide-band-gap devices calls for innovative packaging schemes and solutions, their impact on the packaging materials market will be rather limited due to the still-small share of SiC and GaN technologies compared to silicon, and the smaller die size compared to silicon devices. Consequently, innovative packaging technology solutions will only have a minor impact on the discrete power device packaging market.
DISCRETE POWER PACKAGING STILL OFFERS OPPORTUNITIES FOR MATERIALS SUPPLIERS AND PACKAGING COMPANIES
Discrete device makers (i.e. Infineon, ON Semiconductor, ROHM Semiconductor, Fuji Electric) can manufacture power devices internally or by subcontracting the packaging to outsourced semiconductor assembly & test (OSAT) companies. Device makers and OSATs are both looking to offer innovative packaging solutions to their customers. Generally, during the first technology adoption phases, the innovative products are made internally. Once the demand for units becomes important, the devices manufacturers license the technology to other companies or use OSATs, which have huge manufacturing capacities. Die-attach materials, epoxy molding compounds, and interconnection materials are typically supplied by the same materials suppliers, which also provide these solutions to other markets (power modules, multichip devices, etc.). Leadframes are supplied primarily by numerous Asian materials suppliers, since low cost and high volumes are important factors. With increasing application requirements (i.e. thermal cycling capability in electric vehicles), along with reducing device size and increasing device package-design complexity, players that can provide specific solutions and ensure tight angular and dimensional tolerances in highvolume production are increasingly sought by device packaging companies.
Advanced packaging companies like Amkor, ASE, Carsem, and UTAC have significant experience in the packaging of various complex devices for smartphones and microelectronic applications. Power electronics, especially at low and midpower range, represents an opportunity for them to adapt and transfer their existing advanced packaging solutions to power devices, and thus enlarge their product and customer portfolio. Advanced packaging solutions’ highest added-value is not in “rather simple” discrete devices, but in devices integrated with a driver, multichip devices, etc. Nevertheless, it is worth following the transformation trends in advanced packaging towards power devices, in order to not miss out on the growing business opportunities in discrete power device packaging.
Ackotec Plating Ltd., Alpha Assembly Solutions, ABB, Alpha and Omega Semiconductor, Analog Devices, Amkor, ASE, Chang Wah Technology, Carsem, Cree, Delo, Diodes, Dialog- Semiconductor, Danfoss, Furukawa Electric, Fuji Electric, Hitachi, Heraeus, Henkel, Indium
Corporation, Infineon, IXYS, Jentech Precision, JinLin Technology, Jinan Jingheng, Yamada Electronics Precision Technology Co., KCC, Kenly Precision Industrial Co. Ltd, Kyocera, Littelfuse, Mediatek, Maxim Integrated, Microsemi (Microchip Technology), Mitsubishi Electric, Nantong Fujitsu Microelectronics, NXP, Nexperia, Nanjing Changjiang Electronics Group, Ningbo Hualong Electronics Co. Ltd., Ningbo Dongsheng Integrated Circuit, Ningbo Kangqiang Electronics Co, ON Semiconductor, Poongsan Corporation, Powerex, Panasonic, Qualcomm, Renesas, ROHM, STMicroelectronics, Semikron, Sanken Electric Company, SHAP, ShinEtsu, Shindengen, Samsung, SDI, Sino-Microelectronics, Toshiba, TSP Co. Ltd., UTAC, Taixing Yongzhi, Taizhou Yourun Electronics Co., Ltd., Texas Instruments, TG Griset, Taiwan Semiconductor, Vishay Intertechnology, Wieland, Wuxi Huajing Leadframe Co., Xiamen Yonghong Technology and more.
Power Discrete Packaging Comparison 2018 – By System Plus Consulting
A cost-oriented overview of evolutionary trends in power discrete packages, from mW to kW.
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