Discrete Power Device Packaging: Materials Market and Technology Trends 2019

Yole Développement

Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.

Key features of the report

  • Overview of the main applications for discrete power devices, along with their drivers and future trends
  • Analysis of each packaging component, along with forecasts and future technology development
  • Examination of the discrete power-device supply chain (devices and packaging components)
  • Review of the shifting business models, synergies with other industries, and opportunities for newcomers in discrete power devices

 

Objectives of the report

  • Provide an overview of the main applications for discrete power devices, along with their drivers and future trends
  • Discuss the impact of application trends on package design and packaging materials
  • Furnish an analysis of each packaging component, along with forecasts and future technology development
  • Offer an overview of the discrete power device supply chain (devices and packaging components)
  • Analyze the shifting business models, synergies with other industries, and opportunities for newcomers in discrete power devices

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