Discrete Power Device Packaging: Materials Market and Technology Trends 2019

Macro shot of power transistors on the black surface
Yole Développement

Despite the transition to SiP, SoC, and power modules, discrete device packaging still represents a big opportunity especially for materials suppliers.

Key features of the report

  • Overview of the main applications for discrete power devices, along with their drivers and future trends
  • Analysis of each packaging component, along with forecasts and future technology development
  • Examination of the discrete power-device supply chain (devices and packaging components)
  • Review of the shifting business models, synergies with other industries, and opportunities for newcomers in discrete power devices

 

Objectives of the report

  • Provide an overview of the main applications for discrete power devices, along with their drivers and future trends
  • Discuss the impact of application trends on package design and packaging materials
  • Furnish an analysis of each packaging component, along with forecasts and future technology development
  • Offer an overview of the discrete power device supply chain (devices and packaging components)
  • Analyze the shifting business models, synergies with other industries, and opportunities for newcomers in discrete power devices

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