The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
- Assessment of two newly-emerging market applications:
- Stand-alone code / data storage
- Embedded NVM for analog ICs
- Breakdown of the storage-class memory (SCM) market into:
- Persistent memory – non-volatile dual in-line memory modules (NVDIMMs)
- Low-latency storage – enterprise and client SSDs •
- Update on stand-alone phasechange memory (PCM): potential new entrants, possible market evolution scenarios, next-generation Optane™ products, and competing technologies (e.g. Micron’s X100)
- Update on newly emerging technologies, including ferroelectric memory (e.g. FeFETs) and nanotube RAM (NRAM)
- Updated list of Chinese memory players and related emerging NVM activities, and more.
- 2019- 2025 market forecast in $US, Gbit, wafers starts, and units
- Competitive landscape and market dynamics
- Emerging NVM – potential applications and market drivers
- Technology roadmaps, with timeto- market
- Price evolution, by application and technology
- Technology description and main technical trends, along with overview of main players and product-development roadmaps
Present an overview of the semiconductor memory market: stand-alone (NAND, DRAM, NOR, etc.) and embedded memory (eFlash, SRAM)
- Provide an understanding of emerging NVM applications: market drivers & challenges, technology roadmap, players, and main trends
- Offer 2019-2025 market forecasts for the emerging NVM business
- Describe emerging NVM technologies:
- Working principle, manufacturing methods, advantages/limitations, development status, price, time-to-market
- Latest product development status for each key market player
- Detail and analyze the competitive landscape: recent acquisitions and funding, latest company news and key players, by technologies and applications
Table of Content
Scope, objectives, and methodologies 13
Executive summary 27
Context – overview of the memory business 56
Stand-alone memory 61
Embedded memory 78
Memory market players 88
Emerging NVM – overview 104
Emerging NVM applications 118
Fast / reliable memory for industry, defense, etc. 125
Code / data storage 130
Persistent memory 134
Low-latency storage 141
Embedded NVM for analog ICs 146
Embedded NVM for MCU, SoC, ASIC, etc. 150
Embedded cache memory for CPU/APU 162
Embedded NVM for AI in-memory computing 172
Emerging NVM market forecast (2019 – 2025) 181
Market forecasts – in units, $M, Gb, and 12’’ eq. wafers 195
MRAM technology, roadmaps, and players 223
Other emerging NVM technologies (NRAM, FeFETs) 294
China memory landscape 302
Summary and conclusions 314
Mergers & acquisitions, partnerships and funding 336
Yole Développement’s presentation 346
PCM-BASED PERSISTENT MEMORY HIT THE MARKET IN 2019, AND EMBEDDED STT-MRAM HAS FINALLY MOVED INTO MASS PRODUCTION
The last three years have witnessed the takeoff and rapid expansion of the storage-class memory market that is projected to reach billion-dollar revenue within the next few years. Key to this was the introduction of 3D XPoint, a stand-alone phase-change memory (PCM)-based technology developed by Micron and Intel and commercialized by Intel since 2017 with the brand name Optane™. In early 2019, Intel started commercializing Optane™ Persistent Memory together with the latest generation of Xeon scalable processors (i.e. Cascade Lake). A number of leading companies have been exploring the use of persistent memory for a host of datacenter applications – according to Intel, there are currently more than 200 ongoing proofof- concepts based on Optane™ NVDIMMs, and the conversion rate from proof-of-concept to deployment has already exceeded 80%.
In late 2019, Micron revealed its own 3D XPointbased SSD named X100, and other IDM players could enter the storage-class memory (SCM) market in the coming years. However, Intel has a significant advantage in the persistent-memory business as it is the only player capable of providing a complete solution for data-intensive applications via combinations of Cascade Lake CPUs and Optane™. Intel’s competitors face delays as they need to work on alternative architectures that leverage new interconnects and protocols that are currently being developed. An in-depth overview of the growing persistentmemory business, its competitive landscape, product roadmaps and players’ dynamics is provided in this report.
Among the embedded emerging NVM technologies, MRAM has advanced at a relatively faster pace thanks to the strong involvement of IDM/foundries and the support of equipment suppliers which have been providing new solutions to difficult technical challenges. Notably, in March 2019 Samsung announced the mass production of embedded MRAM for applications in MCUs, Internet-of-Things (IoT) applications, and memory buffers.
THE OVERALL EMERGING NVM MARKET IS POISED TO REACH OVER $6B IN 2025. THE EMBEDDED BUSINESS WILL ACCOUNT FOR 1/3 OF IT
The stand-alone emerging NVM market will grow to ~$4.1B in 2025. It will be driven by two key segments: low-latency storage (enterprise and client drives) and persistent memory (NVDIMMs). PCM will be the leading technology thanks to the sales of 3DXPoint products – particularly NVDIMMs – which are sold by Intel in a bundle with its server CPUs. In 2019, Everspin entered pilot production of 1Gb STT-MRAM parts at GlobalFoundries (28nm). In the coming years, STT-MRAM market penetration will continue through the adoption of 1Gb chips in special drives (e.g. storage accelerator, FinTech drives). If successfully executed, this will promote sales/ volume growth and motivate foundries to continue supporting the MRAM business through the development/manufacturing of high-density parts (≥ 4Gb).
So far, RRAM has been commercialized mainly by Adesto with low-density CBRAMTM products for EEPROM replacement. The highest RRAM density today is only 8Mb (Fujitsu-Panasonic), but swift progress is expected: new 100Gb-class chips for low-latency storage products by an IDM player are anticipated for 2020.
Embedded emerging NVM is now in the takeoff phase and will be driven by MCUs and IoTs, as well as memory buffers for ASIC products (i.e. AI accelerators, display drivers, and CMOS image sensors). We expect embedded MRAM will lead the embedded emerging NVM market in the next five years. However, PCM and RRAM are not out of the race: due to their unique memristive properties (synapse-like), both are promising for analog inmemory- computing applications that could take off by 2023.
This report by Yole Développement details the market evolution for each application, and describes the challenges and the strategies for an effective ramp-up of emerging memories.
FOUNDRIES AND IDMS ARE ACCELERATING THE ADOPTION OF EMBEDDED EMERGING NVMS AT ADVANCED TECHNOLOGY NODES. THE RISE OF IN-MEMORY COMPUTING IS TRIGGERING NEW PLAYERS’ DYNAMICS
In the last three years, top foundries/IDMs have been developing 28/22nm technology processes for emerging NVMs.
Samsung Foundry has been working exclusively on embedded MRAM and was the first player to announce volume production in March 2019 (28nm FDSOI). GlobalFoundries will enter the market with embedded MRAM for replacing eFlash on 22nm FDSOI, and is working on a SRAM-like version for advanced nodes (12nm FinFET). TSMC is offering embedded MRAM on 22nm (planar bulk), as well as RRAM on 40nm and 22nm; the target applications for TSMC’s RRAM are low-power and low-cost IoTs and PMICs. UMC is developing both MRAM and RRAM 28/22nm (planar bulk). After working quietly on MRAM for several years, Intel is prepping for production of embedded MRAM on 22nm FinFET. Promising L4-cache applications have also been demonstrated for example at the IEDM 2019 conference.
With the slowdown of the mobile market, foundries are looking for new growth opportunities – and the huge stand-alone memory market appears a very appealing target. At the same time, IDM players are increasing their foundry activities to prepare for the deployment of “in-memory computing” that aims at reducing latency and improving system performance through a close integration of memory and logic. The acquisition of embedded NVM knowhow is expected to enable business expansion in these two directions. In this context, Intel is once again in a unique position as it plays on both sides: it develops embedded memory for its huge CPU business and is also involved in stand-alone memory (3D NAND and 3DXPoint). Hence, it is no surprise that Intel has internal development activities on all emerging NVM technologies, including the latest generation of ferroelectric field-effect transistors (FeFETs). All such players’ dynamics and struggles for success in the competitive memory business are presented in detail in the 2020 report edition.
4DS, Adesto, Aeroflex, Antaios, Apple, Applied Materials, ARM, Avalanche, Buffalo, Canon Anelva, CEA Leti, ChangXin Memory Technologies, Cisco, Crocus Nanoelectronics, Crossbar, Cypress, Dell, eBay, EMC, Evaderis, Everspin, Facebook, Ferroelectric Memory Company, Fujitsu, Fusion IO, GigaDevice, GlobalFoundries, Google, H-Grace, Hikstor, HLMC, Honeywell, HP, HProbe, Huawei, IBM, Imec, Infineon, Intermolecular, Innovative Silicon, Intel, ITRI, Jiangsu Advanced Memory Technology, Kioxia, Lenovo, Macronix, Maxim, Materion, Mediatek, Microchip, Micron, Mythic, Nantero, Nanya, National Tsing Hua University, NEC, NetApp, Nike, Nokia, Numen, Numonyx, NXP, Panasonic, Qualcomm, Quantum, Rambus, Reliance, Renesas, Samsung, SanDisk, Seagate, SK Hynix, Smart Modular Technologies, SMIC, Sony, Spansion, Spin Memory, Spintec, Spreadtrum, STMicroelectronics, Stanford University, Syntiant, TDK, Tezzaron, Tohoku University, TEL, TEL Magnetic Solutions, Teledyne e2v, Toshiba, Towerjazz, TPSCo, Tsinghua Unigroup, TSMC, UMC, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, YMTC, various emerging Chinese NVM players, and more…
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