High-End Performance Packaging: 3D/2.5D Integration 2020

Yole Développement

Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?

Key features of the report

  • Yole Développement’s definition of high-end performance packaging
  • High-end performance packaging market segmentation
  • Market valuation based on topdown and bottom-up models in package units, revenue and wafer production volumes
  • Market valuation of key high-end packaging technologies: 3D SoC, 3D stacked memory, 2.5D interposers, UHD FO, embedded Si bridge
  • Includes COVID-19 impact on all forecasts
  • High-end performance packaging market trends: end-system drivers
  • Commercialization of high-end performance packaging products
  • Global mapping of high-end performance packaging supply chain
  • Supply value chain analysis in highend performance packaging
  • State-of-the-art technologies and trends
  • Application technology roadmap of high-end performance packaging
  • Key player’s technology roadmap of high-end performance packaging: Intel, TSMC and Samsung
  • IP analysis: 3D SoC – hybrid bonding

Objectives of the report

  • To identify and describe which technologies can be classified as high-end performance packaging
  • To define high-end performance packaging
  • To analyze key market drivers, benefits and challenges of high-end performance packaging by application
  • To describe the different existing technologies, their trends and roadmaps
  • To analyze the supply chain and high-end performance packaging landscape
  • To update the business status of high-end performance packaging technology markets
  • To provide a market forecast for the coming years, and estimate future trends

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