Founded in 2001, Chinese company Hikvision is now the world leader of the surveillance camera market. Up against renowned European companies like Bosch, Axis and the American company FLIR, Hikvision today has over 19,000 R&D engineers among 40,000 employees worldwide to protect its market share and tackle futures challenges driven by connected technology accessibility and city security reinforcement.

Hikvision has a broad range of cameras covering many applications including network, pan/tilt/zoom (PTZ), thermal, traffic and checkpoint cameras and manages to control every production step. The company has invested in high-tech factories and equipment for manufacturing including surface mount technology, MEMS and packaging and system assembly lines.

This full reverse costing study has been conducted to provide insights into technology data, manufacturing cost and manufacturer price of one thermal network camera supplied by Hikvision.

This system integrates in-situ Artificial Intelligence (AI) processing, for a total power consumption of 10W. Integrating a 17µm local microbolometer and a HiSilicon Internet Protocol (IP) camera processor, Hikvision seems to bet on Chinese technology for the high-end functionality of its product. Consequently, it was surprising to discover non-Chinese processing chips inside the system, one in the thermal imaging block and another for the AI block.

With a thermal imaging definition of 640×512 pixels and 50 frames per second, Power Over Internet (PoE) and AI among many features, the DS-2TD2166-15 V1 is very innovative.

Along with the complete teardown analysis, this report includes a complete Bill of Materials, PCB and lens module analyses, electronic board HD photos and main Integrated Circuit (IC) die photos. It estimates material costs and assembly processes in order to deliver a final manufacturer price for this thermal network camera.

 

Overview/Introduction

• Executive Summary
• Main Chipset
• Supply Chain
• Specifications
• Block Diagram
• Reverse Costing Methodology

Company Profile

• Hikvision

Teardown Analysis

• Views and Dimensions
• System Opening
• Electronic Board 1
  • Top Side – High-resolution photos, PCB markings, components markings and identification
  • Bottom Side – High-resolution photos, PCB markings, components markings and identification
• iRay 17µm Microbolometer
• Lens Module

Cost Analysis

• Accessing the BoM
• PCB Cost
• IC Cost
• Mechanicals Cost
• BOM Cost – Main Electronic Board
• BOM Cost – Mechanicals
• Material Cost Breakdown by Sub-Assembly
• Material Cost Breakdown by Component Category
• Assessing the Added Value (AV) Cost
• Electronic Board Manufacturing Flow
• Details of the Main Electronic Board AV Cost
• Details of the System Assembly AV Cost
• Added-Value Cost Breakdown
• Manufacturing Cost Breakdown

Estimated Manufacturer Price Analysis

• Estimation of the Manufacturer Price