Hybrid Bonding – Patent Landscape Analysis 2019


Who has the ability to hamper the development of products using hybrid bonding processes?

Key features of the report

  • IP trends, including time-evolution of published patents, countries of patent filings, etc.
  • Ranking of main patent assignees
  • Key players’ IP position and relative strength of their patent portfolios
  • Patent segmentation per application:
    •    CMOS image sensor (CIS)
    •    Memory
    •    MEMS
    •    LED
  • Key patent identification and details
  • IP profile of key players: Xperi, TSMC, YMTC
  • Excel database containing all patents analyzed in the report, including technology and application segmentations

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