Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode

System Plus Consulting

The first PrimePACK™ 2 product from Infineon implementing IGBT5 and .XT joining technology with copper wire bonding and sintered silver die attach.


  • Detailed optical and SEM photos
  • Precise measurements
  • Material EDX analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated selling price
  • Technology and cost comparisons between, IGBT3, IGBT4 and IGBT5 technologies from Infineon

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