Intel Foveros 3D Packaging Technology

System Plus Consulting

Intel Core i5-L16G7: the first utilisation of Intel’s Foveros Technology with Package-on-Package configuration in a consumer product.

Reverse costing with:

  • Detailed photos
  • Precise measurements
  • Material analysis
  • Manufacturing process flow
  • Supply-chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price
  • Comparison with TSMC’s CoWoS

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