Lithography and Bonding equipment for More than Moore 2021

Yole Développement

All More than Moore device production equipment markets are growing, driven by lithography and bonding, reaching $2.4B in 2026.

What’s new :

  • Updated photolithography technology overview with detailed analysis of projection exposure tools, mask aligners and maskless lithography
  • Detailed analysis of worldwide equipment vendor landscape spanning EMEA, USA and East Asia including financial analysis for market leaders in the lithography and bonding business for More than Moore device manufacturing
  • Updated equipment forecast for 2020-2026 for photolithography and permanent and temporary bonding in terms of units shipped and revenue generated

Report’s key features:

  • Analysis of manufacturing requirements and trends for MEMS and sensors, power, RF, CIS devices and Advanced Packaging
  • Lithography and bonding equipment analysis and benchmarks including technology used, technical specifications, average selling price and throughput
  • 2020 market size analysis with market share and application segment breakdowns
  • Lithography and bonding equipment market forecast breakdown for technologies used and device segments for MEMS, power, RF, CIS and Advanced Packaging

Objectives of the report:

  • To provide an overview of photolithography and permanent and temporary bonding equipment for More than Moore device manufacturing and associated stateof-the-art and emerging processes
  • To provide in-depth understanding of the More than Moore lithography and bonding ecosystem with detailed equipment vendor market presences and market shares in 2020
  • To provide an outlook for the areas with business potential for lithography and bonding equipment
  • To provide 2020-2026 forecast metrics for changing lithography and bonding equipment markets in terms of units shipped and revenue

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