The MRR20 is a 77GHz radar sensor offering mid-range detection for Advanced Driver Assistance Systems (ADAS).
REVERSE COSTING WITH:
- Detailed photos
- Block diagram
- PCB cross-section
- Die picture and cost estimation of the MCU
- Complete and priced bill-ofmaterials
- Manufacturing process flow
- Manufacturing cost analysis
- Estimated sales price
Table of Content
- Executive Summary
- Main Chipset
- Block Diagram
- Company Profile
- Views and Dimensions of the Radar
- System Opening
- Electronic Boards
- External View
- High Definition Photo
- Components Markings and Identification
- Radar Configuration
- Assessing the BOM
- PCB Cost
- Estimation – Integrated Circuit
- Estimation of the Cost of the Top Housing
- BOM Cost –Electronic Board
- Housing Parts – Estimation
- BOM Cost – Housing
- Material Cost Breakdown by Sub-Assembly
- Material Cost Breakdown by Component Category
- Assessing the Added Value (AV) Cost
- Electronic Board Manufacturing Flow
- Details of the Main Electronic Board AV Cost
- Details of the System Assembly AV Cost
- Added-Value Cost Breakdown
- Manufacturing Cost Breakdown
Estimated Price Analysis
- Estimation of the Selling Price
In the world of the automobile, Advanced Driver Assistance Systems have become a must-have for all new cars and for autonomous driving. Manufacturers are developing ever more efficient radars to ensure a better, safer drive. Mando usually produces radars for Hyundai and Kia models. Now, Mando has released a new model to improve radar performance and quality.
The mid-range radar sensor, with its three transmitter and four receiver channels, operates in the 76-77GHz frequency band that is standard for automotive radar applications.
The system integrates one electronic board including Infineon circuits. The Radio-Frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate. It is equipped with planar antennas.
Infineon’s 77GHz SiGe Monolithic Microwave Integrated Circuits (MMICs) are used as the high-frequency transmitter and receiver. The two RF dies are packaged in the version of the eWLB Fan-Out Wafer Level Package developed and manufactured by Infineon.
Based on a complete teardown analysis of the Mando radar, this report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor. The report also includes a physical analysis of the microcontroller unit, a complete cost analysis and selling price estimation.
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