The smallest camera in the world for endoscopes is based on a fully wafer bonded technology, with CIS, packaging and optic on the same wafer.
Reverse costing with:
- Analysis of the camera module structure, including CIS, WLP and WLO
- Detailed optical and SEM photos
- Precise measurements
- Supply chain evaluation
- Manufacturing cost analysis
- Estimated selling price
- Technology comparisons between the new Xintec WLP and VisEra WLO technologies and the older CameraCubeChip model
Table of Contents
- Executive Summary
- Reverse Costing Methodology
- OmniVision Technologies Inc
- OVM6948 CameraCubeChip
- Summary of the Physical Analysis
- Endoscope Camera
- Module views
- Module opening
- System cross-section
- Camera Module
- Module view and dimensions
- Module cross-section
- Wafer level optic
- CMOS Image Sensor
- Die overview and dimensions
- Die process & cross-section
- Die process characteristics
Manufacturing Process Flow
- CMOS Image Sensor Die Front-End Process and Fabrication Unit
- CSP WLO Process Flow and Fabrication Unit
- Summary of the Cost Analysis
- Yield Explanation and Hypotheses
- CIS Wafer Cost
- Pixel Array
- BSI + Color Filter
- Wafer Level Package Wafer Cost
- Wafer Level Optic Wafer Cost
- OVM6948 Camera Cost
- Cost Comparison
Estimated Selling Price
The endoscopy market was worth $6B in 2019, with reusable flexible endoscopy being the major market, worth more than $4B. However the new standard for small diameter endoscopes, specifically bron-choscopes and urethroscopes, is now becoming disposable flexible endoscopes. Omnivision is one of the leaders in providing very small camera modules aiming at supplying this new, developing market.
This full reverse costing study has been conducted to provide insights into technology data, manufacturing cost and selling price of the OVM6948 CameraCubeChip module supplied by OmniVision. This complete module can be integrated into a disposable guidewire, catheter or endoscope.
The smallest camera in the world, it is a Video Graphics Array (VGA) camera module. It integrates a Wafer-Level Packaged (WLP) OmniVision CMOS Image Sensor (CIS) and a small Wafer-Level Optic (WLO) manufactured by VisEra. The entire camera module is provided in a 0.65mm x 0.65mm x 1.2mm 4-pin package including a 0.58mm x 0.58mm CIS die. The CIS die is packaged by Xintec’s new WLP technology for CIS. The bumps on the backside are connected with Through Silicon Vias (TSVs). A complex stacking of eight optical layers in 1mm is necessary to provide the wide 120 degree field of view and an extended focus range of 3mm to 30mm. Moreover, the OMV6948 is a fully wafer bonded solution.
The report includes technology and cost analyses of the OmniVision’s camera module. These analyses focuses on the three parts, CIS, WLP and WLO. That includes a Back-Side Illumination (BSI) image sensor with a resolution of 40 kilopixels developed by Omnivision, and the multilens module developed by Visera Tech.
Along with the complete physical analysis, this report analyzes costs and estimates prices for the OVM6948 CameraCubeChip. This report includes a comparison between the new WLP from Xintec and WLO from VisEra used for the OVM6948 and their oldest technologies studied for extra small VGA cameras. The comparisons highlight differences in terms of structure.
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