Qualcomm QET5100M Envelope Tracker Module with SEMCO’s Embedded Die Packaging Technology

System Plus Consulting

The first device featuring six-layer embedded die packaging technology found in the consumer market from SEMCO and Amkor.


  • Detailed photos and cross-sections
  • Precise measurements
  • Material analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price
  • Comparison with TDK Semiconductor Embedded in SUBstrate (SESUB)

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