Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 – 2020.
Complete teardown with :
- Detailed Photos
- Precise Measurements
- Module Opening
- Die Measurements
- Detailed Technical and Cost Analysis of 45 Components
- Complete Bills-of-Materials (BoMs) for the Modules
- Comparison Between Suppliers
- Comparison Between OEMs
- Cost Comparisons
Last year, System Plus opened hundreds of front-end modules (FEMs) and components to provide an overview of the radio frequency (RF) FEM market in select flagship smartphones. The information was gathered in four reports, ranging from player’s evolution to World Area Analysis. This provided an excellent means of tracking this technology market’s evolution.
This year, System Plus Consulting will again offer different volumes of technical and cost comparisons of smartphone RFFEMs. Each comparison report will focus on a specific subject – for example, a player’s evolution, a specific technology, or a comparison of flagship devices.
In this first volume of 2021, we provide insights into technology and cost data for FEMs and several components found in 18 smartphones from the Apple iPhone series since 2016. This includes a comprehensive overview of the RFFEM architectures on the market that compare available smartphones from these companies. Apple’s dependency on specific component manufacturers is revealed, along with the different choices for integration of communication technology, even millimeter wavelength (mmWave) signal support in the latest generation. We also reveal how the company maintains its leadership on the premium market.
Through these smartphone teardowns, the main RF modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes, and technologies are studied as well, providing a large panel of technical and economic choices and an overview of the market.
Every component has been analyzed to understand the manufacturing process cost.
This report also includes a technical and cost comparison of the modules and seeks to explain the smartphone makers’ choices and supplier tendencies. All RFFEM are integrated in this report, from baseband to antenna tuner, on 5G, 4G, Wifi, BT, GPS, and UWB.
Table of Contents
Company Profile: Apple
Apple iPhone Series: SE, 7 Plus, 8 Plus, X, Xs Max, 11 Pro Max, SE (2020), 12 Pro Max
Physical and Cost Analysis
- Baseband – Front-End Analysis
- Qualcomm Front-End Analysis
- 4G LTE – Front-End Analysis
- Broadcom, Murata, and Skyworks Front-End Analysis
- Antenna Adaptation – Front-End Analysis
- Qorvo, Murata, and Broadcom Front-End Module Analysis
- 5G Sub-6 – Front-End Analysis
- Murata and Skyworks Front-End Analysis
- UWB/Wifi/BT/GPS – Front-End Analysis
- Broadcom, Murata, Skyworks, and USI Front-End Module Analysis
- Area Distribution per Supplier & Function
- Qualcomm Content – 4G LTE vs. 5G NR
- Apple iPhone 12 Pro Max vs. Samsung Galaxy Note20 5G and OnePlus 8 5G – 5G Chipset Cost and Component
- Die Design Win in Number & Area
- Die Distribution per Function
- Filter Distribution per Smartphone: Technology & Substrate
- PA/LNA/Switch Distribution per Smartphone: Technology & Substrate
- Material Substrate Distribution per Smartphone
- Chipset Cost Evolution
- Cost Distribution per Supplier & Function
Qualcomm Content – 4G LTE vs. 5G NR
Related Reports & Monitors
RF Front-End Module Comparison 2020 – Volume 4
Reverse Costing - Structural, Process & Cost Report
Smartphone Design Win Quarterly Monitor
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