Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone X

System Plus Consulting

The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC’s updated inFO packaging

REVERSE COSTING WITH

  • Detailed photos: cross-sections
  • Precise measurements
  • Materials analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price
  • Technology comparison with standard PoP, Shinko’s MCeP PoP and TSMC’s inFO first generation

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