Status of the Advanced Packaging Industry 2019

Yole Développement

Despite the semiconductor industry’s slowdown, advanced packaging is growing at an impressive 8% CAGR (2018 – 2024).

What’s new

  • Updated forecast of the semiconductor market including memory & non-memory components
  • Update of advanced packaging market data (2018-2024):
    • By revenue, wafer, and unit forecasts
    • By advanced packaging platforms: flip-chip, fan-out, fan-in, 2.5D/3D IC, embedded die
  • Analysis of US-China effect on semiconductor business & supply chain
  • Included 2018 – 2024 revenue, wafer, and unit forecasts, by various application segments: consumer & mobile, automotive & transportation, telecom & infrastructure, medical, industrial, defense & aerospace
  • Updated supply chain analysis with focus on impact of foundry entry into advanced packaging business
  • Wafer starts share by manufacturers from different business model (IDM, OSAT, foundry) by different advanced packaging platform and its evolution
  • Updated financial analysis of the top 25 OSATs (2018-2013) by different parameters: revenue, YoY growth, R&D, Capex, gross profit, gross margin, net income etc.
  • M&As data update and different scenarios for OSATs for 2019-2024

Key features of the report

  • Advanced packaging – market overview
  • Drivers and dynamics
  • Future applications
  • Disruptions and opportunities
  • Technology trends and forecasts
  • Revenue, wafer, and unit forecasts, per platform
  • Future development, per platform
  • Impact of front-end scaling
  • Supply chain analysis
  • Production overview, per player (IDM, OSAT, foundry)
  • Supply chain analysis and shifting business models
  • Financial analysis of the top 25 OSATs

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