Status of the Advanced Packaging Industry 2020

Yole Développement

OSATs, foundries, and IDMs all want to impact the growing advanced packaging market.


  • Updated forecast of the semiconductor market, including memory and non-memory components
  • Key system-level demand forecast: mobile & consumer, automotive, telecom & infrastructure
  • Update of our advanced packaging market data (2019 – 2025):
    • By revenue, wafer, and unit forecasts
    • By advanced packaging platform: flip-chip, fan-out, fan-in, 3D stacked, embedded die
    • By different application segment
  • Summary of COVID-19’s impact on all forecasts
  • Analysis of the “U.S. – China effect” on the semiconductor business and supply chain
  • Revised supply chain analysis, with focus on the impact of foundries entering the advanced packaging business
  • Wafer-starts share and evolution, by manufacturers from different business models (IDM, OSAT, foundry) and by different advanced packaging platforms
  • Updated financial analysis of the top 25 OSATs (2019 -2013), by different parameters: revenue, YoY growth, R&D, capex, gross profit, gross margin, net income, etc.
  • M&A data update and different scenarios for OSATs, covering 2019 – 2025


  • Advanced packaging market overview
  • Drivers and dynamics, disruptions, and opportunities
  • Market forecast
  • Technology trends and forecasts
  • Revenue, wafer, and unit forecasts, per platform and applications segment
  • Future development, per platform
  • Impact of front-end scaling
  • Supply chain analysis
  • Production overview, per player (IDM, OSAT, foundry)
  • Supply chain analysis and shifting business models
  • Financial analysis of the top 25 OSATs
  • M&A analysis and recent developments


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