Status of the Power Module Packaging Industry 2019

Yole Développement

Major evolutions in substrate, interconnection, and die-attach technologies, driven by EV/HEV, are transforming the power module packaging supply chain

What’s new

  • Update on key packaging trends
  • Focus on SiC and GaN power device packaging
  • Deep insight into power module substrates, technology trends, and supply chain
  • Focus on embedded die solutions
  • Focus on Intelligent Power Modules (IPMs)

Key features

  • Overview of the main applications for power devices, along with their drivers and future trends
  • Analysis of the application trends’ impact on package design and packaging materials demand
  • Detailed analysis of each packaging component, along with 2018 – 2024 market data
  • Insight regarding key technology trends
  • Analysis of the power module supply chain (devices and packaging components) technology

 

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