Status of the Power Module Packaging Industry 2021

Yole Développement

EV/HEVs are transforming the power module packaging supply chain with the evolution of substrate, interconnection, and die-attach technologies. Lower cost is starting to win over higher performance.

 

What’s new:

  • Update on key power module packaging trends
  • Focus on SiC and GaN power device packaging
  • Deep insight into power module substrates, technology trends, and supply chain
  • Focus on power module packaging requirements for various applications
  • Focus on China
  • Focus on 800V battery – impact on power module packaging

 

Key features of the report:

  • Overview of the main applications for power devices, along with their drivers and future trends
  • Analysis of application trends’ impact on package design and packaging material demand
  • Detailed analysis of each packaging component, along with 2020-2026 market data
  • Insight regarding crucial technology trends
  • Analysis of the power module supply chain for devices and packaging components
  • Analysis of power module packaging requirements for various applications including EV/HEV, rail, motors, wind, PV and UPS
  • Analysis of impact of COVID-19 on the power electronic industry
  • Focus on China

 

Objectives of the report:

  • Provide an overview of the main applications for power devices, along with their drivers and future trends
  • Discuss the impact of application trends on package design and packaging materials
  • Furnish an analysis of each packaging component, along with forecasts
  • Identify the key technology trends that will shape the future power packaging market
  • Deliver an overview of the power module supply chain for devices and packaging components
  • Analyze the shifting of business models, synergies with other industries, and power device opportunities for newcomers

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