TDK SESUB Bluetooth Module

System Plus Consulting

Latest Release of TDK Embedded Die Package Technology

 

REVERSE COSTING WITH

  • Detailed photos and cross-sections
  • Precise measurements
  • Material analysis
  • Manufacturing process flow
  • Supply chain evaluation
  • Manufacturing cost analysis
  • Estimated sales price
  • Comparison with AT&S Embedded Component Technology (ECP)

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