Thinning Equipment Technology and Market Trends for Semiconductor Devices 2020

Courtesy of Infineon Technologies AG, 2020_bd
Yole Développement

Memory, CIS, and power applications are driving the wafer thinning equipment market, before a new wave of innovation by 2025.

Key features

  • Comprehensive analysis of the major applications currently using thinning methods, and potentially attractive applications that could require the use of different thinning technologies in the future
  • Describe the key benefits and added value of thinning technology in the semiconductor field
  • Thinning technology by device roadmap
  • 2019-2025 thinning equipment market forecast: breakdown by device type, by substrate type and by equipment technology
  • Describe the competitive landscape and identify key players in technology development
  • 2019 global thinning equipment market share in the field of semiconductor
  • Discuss technology processes, specifications, and supply chain

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