First mass-produced MEMS speaker based on SOI and PZT thin film technology.
REVERSE COSTING WITH:
- Detailed photos
- Precise measurements
- Piezoelectric actuator cross-sections
- Materials analysis
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis
- Selling Price estimation
Table of Content
- Executive Summary
- Piezoelectric Devices Analyzed, by Function
- USound, STMicroelectronics
- Piezoelectric-Based Device Market
- Piezoelectric material: Function and Integration
- Physical Analysis Methodology
- Package views, dimensions and marking
- Package opening and cross-section
- MEMS Speaker Die
- Views, dimensions and marking
- MEMS opening and cross-section
- Process characteristics
Manufacturing Process Flow
- Global Overview
- MEMS Front-End Process
- MEMS Wafer Fabrication Unit
- Package Assembly Unit
- Back-End: Final test
- Yield Explanations and Hypotheses
- MEMS Speaker
- Front-end cost
- Wafer and die cost
- Thin Component
- Back-end: Packaging and final test cost
- Component cost
- Manufacturer Financial Ratios
- Estimated Manufacturer Price
Voice-enabled devices are shaping people’s everyday lives; smartphones, smart speakers and wireless EarPods integrate both microphones to capture our voices and microspeakers to create sound. The legacy electrodynamic and balanced-armature microspeaker market has reached almost $9B and is expected to grow to more than $10.5B in 2024. Good sound quality, low power consumption and lower physical volume are the main drivers of the microspeaker consumer market.
In this context, System Plus Consulting conducted a full reverse costing study of the USound UT-P 2016, the first mass-produced MEMS speaker. It is smaller than the classical speaker, with a volume of only 49mm3, and has been developed for in-ear audio systems. USound has developed the technology to bring together several MEMS speakers, up to 80, to increase the output sound power and give better spatial sound distribution.
The piezoelectric speaker is manufactured by STMicroelectronics which has developed piezoelectric (PZT) technology to add it to its MEMS portfolio technologies. But the PZT actuator is not the only innovative MEMS process. The actuators are manufactured on thin membranes etched by micromachining on SOI substrates, another specialty of STMicroelectronics.
The secret of the first MEMS speaker is not only in the silicon. The package is very important because the acoustic membrane is fixed onto the package, with a consequent impact on the sound quality. All package structures are designed to enhance sound quality and protect the silicon MEMS, as shown on the cross-section and disassembly pictures.
This report includes technology and cost analysis of the UT-P 2016 MEMS Speaker. These analyses provide the technical intelligence necessary to understand this technology.
Related Reports & Monitors
Sensirion SCD30: NDIR CO2 and Humidity Sensor
Reverse Costing - Structural, Process & Cost Report
Hybrid Bonding – Patent Landscape Analysis 2019
Need to discuss?
We are open for discussionContact us