Fourth generation of the S-Cam family from the leading ADAS camera player.
REVERSE COSTING WITH:
- Detailed photos
- Precise measurements
- Materials analysis
- Complete bill of material
- Component pricing
- Detailed technological and cost analysis of camera and CMOS image sensor
- Physical comparison with ZF S-Cam3
- Manufacturing process flow
- Supply chain evaluation
- Manufacturing cost analysis in two countries
- Selling price estimation for two annual volume scenarios in each location
Table of Contents
MONO & TRI SYSTEMS
ZF Friedrichshafen AG Company Profile
- Views and Dimensions of the Camera
- System Opening
- Electronic Board
- Accessing the BOM
- PCB cost
- BOM cost – electronic board
- BOM cost – housing
- Material cost breakdowns
- Accessing the Added Value (AV) cost
- Electronic board manufacturing flow
- Details of the electronic board AV cost
- Details of the system assembly AV cost
- Added-value cost breakdown
- Manufacturing Cost Breakdown
- Financial Ratios
- Estimation of the Manufacturer Price
LENS MODULE AND CIS
Omnivision Company Profile
- Mono Cam – Lens Module
- Tri Cam – Lens Module #1
- Tri Cam – Lens Module #2
- Tri Cam – Lens Module #3
- Omnivision CMOS Image Sensor
- Packaging, sensor die and cross-section
- Front-End Process Flow
- CIS Wafer Fabrication Unit
- Die Process Flow
- CIS Packaging Fabrication Unit
- Packaging Process Flow
- Yield Hypothesis
- CIS Front-End Cost
- Packaging Cost
- Component Cost
Currently, automotive manufacturers are integrating more options for security and are making cars safer with Advanced Driver Assistance Systems (ADAS). Automotive cameras therefore have quickly become more common in the last few years and are now an important part of the imaging market.
ZF, one of the largest tier one suppliers of automotive systems, last year released its fourth Generation S-Cam with two solutions, one with a mono camera and the other with a triple camera set-up.
These cameras feature the Omnivision CMOS image sensor, which demonstrates the shift in the procurement strategies of ZF and Intel Mobileye. In fact, the use of the latest Mobileye EyeQ4 vision processor allows new sensors to be used and makes the S-Cam4 one of the smallest and lightest products in its category.
Based on a teardown of the system, these reports detail a complete bill of material and describe the electronics and housing assembling. Moreover, a specific report describes the camera’s manufacturing and packaging processes. They present also a detailed physical analysis of the CMOS image sensor, with a cross-section of the complete camera modules.
These reports also include a comparison with the previous version in the S-Cam series, the S-Cam 3. It estimates the manufacturing cost and selling price for both the mono and tri-camera.
The teardown and the cost analysis of the System On Chip (SOC) is available in the related report “Mobileye EyeQ4 Vision Processor Family”.