3D TSV and 2.5D Business Update – Market and Technology Trends 2017

Yole Développement

3D integration, a leading-edge technology supporting high-performance applications – from imaging to artificial intelligence, an entire ecosystem in motion

 

WHAT’S NEW

This report’s objectives are to:

  • This report is split into two parts: one dedicated to high-performance products (high-end), the other to products requiring heterogeneous integration (low and middle-end): imaging, sensing, connecting, and lighting.
  • Detailed analysis of markets requiring 3D and 2.5 integration (datacenters, high-performance computing, AR/VR, automotive, etc.)
  • Focus on deep-learning applications and key players’ deep-learning strategies
  • Updated list of commercial and future products
  • Ecosystem and supply chain moves’ analysis, from design to end-customers
  • Forecast of 3D system-on-chip-based products (wafer start, units, and revenue)
  • Review of the different business models present in the current supply chain, along with updated player activity

 

KEY FEATURES OF THE REPORT

  • Latest 3D and 2.5D technology trends
  • Deep analysis of high-performance market dynamics
  • Wafer start, units, and revenue for high-performance applications:
    • breakdown by product (stacked memory, 3D SoC, interposer)
    • breakdown by market segment (datacenters, HPC, AR/VR, automotive)
  • Wafer start, units, and revenue for low and middle-end applications – breakdown by market segment (imaging, RF connecting, sensing, and lighting)
  • Ecosystems, business models, and supply chain: key players’ strategic moves, and detailed activity by player

 

OBJECTIVES OF THE REPORT

This report’s objectives are to:

  • 3D and 2.5D IC packaging technology and market trends, by application
  • Demonstration of how 3D integration is fueled by high-performance applications
  • 2016 – 2022 forecast for high-performance, imaging, sensing, connecting, and lighting – by wafer start, units, and revenue in $
  • Commercialization status of current and future 3D IC products
  • Ecosystems, business models, and supply chain: key players’ strategic moves, and detailed activity by player
  • Technology roadmap for TSV applications

 

 

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