Advanced RF System-in-Package for Cellphones 2019

Yole Développement

5G is pushing innovation for RF front-end SiP

Key features

  • Market overview
    • Drivers and dynamics for 5G varieties: 5G mmWave and 5G sub-6 GHz
    • Disruptions and opportunities thereof
    • Focus on various SiP architectures in cell phones’ RF front-end
    • Focus on cellular and connectivity RF front-end modules
    • Market forecast including wafer-level and SiP-level revenue
    • RF front-end SiP forecast in revenue, wafers, and units by:
      • Cell phone category/type
      • Cellular and Wi-Fi standards
      • Various types of RF frontend SiPs
    • Interconnect trends forecast for RF SiP Technology trends and forecasts
  • Technology trends and forecasts
    • RF front-end multidie system-in-package challenges and technology requirements for 5G sub-6 GHz and 5G mmWave (>24 GHz) bands
    • 5G SiP packaging roadmaps for smartphone front-end
    • Packaging trends for cellular and connectivity modules
    • Antenna-in-package (AiP) trends for 5G mmWave
    • Substrate trends for 5G mmWave
    • Shielding trends
    • RF SiP revenue, wafer, and unit forecasts Supply chain analysis
  • Supply chain analysis
    • Supply chain changes in the new 5G era
    • RF SiP assembly – Detailed supply chain for various players
    • Current RF SiP manufacturers – Strategies and outlook
    • New entries and supply chain disruptions for mmWave packaging
    • Substrate supply chain

What’s new

  • Compared to Yole Développement’s 2017 RF SiP report (where only a PAMiD module forecast was covered), this year’s report extends the RF front-end SiP scope to include all RF front-end SiP for cellular and connectivity functions in cell phones:
    • Cellular:
      • PAMiD
      • PAM
      • Rx DM
      • ASM
      • Antennaplexers
      • LMM
      • MMMB PA
      • mmW FEM
    • Connectivity
      • WiFi FEM
      • WiGig FEM
  • Packaging trends for wafer-level packaging and SiP
  • Interconnect trends for various components in RF SiP
  • RF front-end SiP forecast in revenue, wafers, and units by: cell phone category/type, cellular and Wi-Fi standards, and various types of RF front-end SiPs
  • Antenna-in-package (AiP) trends for 5G mmWave application
  • Substrate trends for 5G
  • RF SiP assembly: detailed supply chain for various players, including substrate supply chain
  • Packaging roadmap and challenges for 5G sub-6 Ghz and mmWave applications

Objectives of the report

Advanced RF SiP for Cellphones 2019 is an updated version of the Advanced RF SiP for Cellphones 2017 report. The objectives of this new report are as follows:

  • Discuss drivers and dynamics for 5G varieties: 5G mmWave and 5G sub-6 GHz, and investigate the disruptions and opportunities thereof
  • Focus on various SiP architectures in the RF front-end of cellphones, for both cellular and connectivity
  • RF front-end SiP market forecast in revenue, wafers, and units by:
    • Cell phone category/type
    • By cellular and Wi-Fi standards
    • By various types of RF front-end SiPs
  • Interconnects trends forecast for RF SiP
  • Analyze various developing RF SiP architectures for sub-6 GHz and mmWave frequencies, advantages and suitability thereof
  • RF front-end multi-die SiP roadmap, challenges, and technology requirements for 5G sub-6 GHz and 5G mmWave (>24 GHz) bands, including antenna-in-package (AiP) trends
  • Analyze supply chain changes and opportunities for 5G in smartphones, focusing on  RF SiP manufacturing and assembly, including package substrate

Liked this post?

Share it on your social networks