Status of the Advanced Packaging Industry 2018

Yole Développement

In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development

WHAT’S NEW

  • 2017-2023 Forecast
  • 2017 M&A activity
  • Ecosystem update
  • Dual and 3D camera trends for mobile
  • Mobile applications and technology
  • Consumer applications
  • Technology update

KEY FEATURES OF THE REPORT

  • Advanced packaging market overview
  • Drivers and dynamics
  • Future applications
  • Disruptions and opportunities
  • Technology trends and forecasts
  • Revenue, wafer, and unit forecasts, per platform
  • Future development, per platform
  • Impact of front-end scaling
  • Scaling and functional roadmaps
  • Supply chain analysis
  • Production overview, per player (integrated-device-manufacturing (IDM), outsourced assembly and testing (OSAT), foundry)
  • Supply chain analysis and shifting business models
  • Financial analysis of top 25 OSATs

OBJECTIVES OF THE REPORT

Advanced Packaging Market overview

  • Drivers and dynamics
  • Future applications
  • Disruptions and opportunities

Technology trends and forecasts

  • Revenue, wafer and unit forecasts per platform
  • Future development per platform
  • Impact of front end scaling
  • Scaling and functional roadmaps

Supply chain analysis

  • Overview of production per player (IDM, OSAT, foundry)
  • Shifting business models
  • Financial analysis of TOP 25 OSATs

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