Wafer to Wafer Permanent Bonding Comparison 2018

System Plus Consulting

Wafer bonding structure, process and cost analysis for CMOS image sensors, inertial, pressure and radio-frequency MEMS devices and LEDs

REVERSE COSTING WITH

  • Package views and dimensions
  • Package cross-sections
  • Precise measurements
  • Wafer bonding process description
  • Cost analysis
  • Cost comparison

Liked this post?

Share it on your social networks