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2018 a turning point for 3D TSV integration: will AI be the real opportunity for 3D and 2.5D integration?

Short Description:
Discover the presentation held by Emilie Jolivet at IMPAS 2018, on March 2018, in Fountain Hill, AZ, USA
Submitted By:
vitrey
Submitted On:
19 Mar 2018
File Size:
5,074.03 Kb
Downloads:
65

2018, the Golden Year for 3D Integration

Short Description:
Discover the presentation held by Thibault Buisson from Yole Développement, during European 3D Summit in Dresden, Germany, on January 22sd 2018. '2018, the Golden Year for 3D Inegration'
Submitted By:
martinleo
Submitted On:
31 Jan 2018
Downloads:
84

3D and 2.5D Technology: Current Adoption, Market Trends & Future Challenges

Short Description:
Discover the presentation held by Emilie Jolivet at MinaPAD, in Grenoble, France on May 2017.
Submitted By:
Robert
Submitted On:
23 May 2017
Downloads:
118

3D Memory Patent Landscape Analysis

Short Description:
Discover the presentation held by Audrey Bastard at Leti’s Workshop, in Grenoble, France on June 2017.
Submitted By:
vitrey
Submitted On:
11 Dec 2017
File Size:
3,590.64 Kb
Downloads:
24

3D Packaging: A Key Enabler for Further Integration and Performance

Short Description:
Discover the presentation held by Thibault Buisson at European 3D Summit, in Grenoble, France, in January 2017.
Submitted By:
Robert
Submitted On:
07 Feb 2017
Downloads:
141

3D Technology Trends & Manufacturing Challenges

Short Description:
Discover the presentation held by Amandine Pizzagalli at EVG Technology Day China, in Shangai, China on March 2017.
Submitted By:
vitrey
Submitted On:
30 Nov 2017
File Size:
5,166.93 Kb
Downloads:
65

3DIC & 2,5D TSV Interconnect Trends

Submitted By:
Submitted On:
30 Sep 2015
File Size:
6,687.23 Kb
Downloads:
217

Advanced Packaging at the Forefront of the Semiconductor Industry: An Overview of Market and Technology Trends

Short Description:
Discover the presentation held by Thibault Buisson on Semicon South East Asia, in Penang, Malaysia, in May 2016.
Submitted By:
Robert
Submitted On:
01 Jun 2016
Downloads:
253

Advanced Packaging Industry 2017

Short Description:
Discover the presentation held by Andrej Ivankovik at ASE Forum Tech, on June 28th 2017, in Nijmegen, Netherlands
Submitted By:
Robert
Submitted On:
07 Jul 2017
Downloads:
156

Advanced Packaging Role after Moore’s Law

Short Description:
Discover the presentation held by Rozalia Beica on NEPCON in Japan, on January 2016.
Submitted By:
Robert
Submitted On:
16 Feb 2016
Downloads:
183
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