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Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony

camera module iphone 5s
2 990 €

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SC iPhone 5S Sony Camera Module 2014All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.

The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.


Camera Module IPhone 5S
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.


  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with previous technology choices from Sony

Table of contents

Camera Module Supply Chain & Companies Profile
Physical Analysis
> Camera Module
- Camera Module View & Dimensions
- Camera Module X-Ray
- Camera Module Disassembly
> CMOS Image Sensor
- View & Dimensions
- Pads, Tungsten Grid
- TSV Connections
- CIS Pixels
- Logic Circuit (Transistors, SRAM)
> Cross-Section: Camera Module
- Overview
- Driver (Assembly & Process) & MLCC
- Ceramic Substrate, IR Filter & FPC
- Lenses, Housing, VCM
> Cross-Section: CMOS Image Sensor
- Overview
- Pad Trenches
- Pixel Array Circuit
- Logic Circuit
- TSVs
> Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony

CIS Manufacturing Process Flow
> Global Overview
> Logic Circuit Front-End Process
> Pixel Array Circuit Front-End Process
> BSI + TSV + Microlenses Process
> CIS Wafer Fabrication Unit

Cost Analysis

> Synthesis of the cost analysis
> Main steps of economic analysis
> Yields Hypotheses
> CMOS Image Sensor Cost
- Logic Circuit Front-End Cost
- Pixel Array Front-end Cost
- BSI & TSV Front-End Cost
- Color Filters & Microlenses Front-End Cost
- Total Front-End Cost
- Back-End: Tests & Dicing
- CIS Wafer and Die Cost
> Camera Module Assembly Cost
- Lens Module Cost
- VCM Actuator Cost
- Final Cost
> Camera Module Cost


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
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Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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