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Apple iPhone 6 Front Camera Modules from Sony

iphone 6 front icon
2 990 €

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iPhone 6 Front flyerVery Innovative CMOS Image Sensor: new pixel array structure / Stacked ISP circuit based on Exmor-RS process/ manufacturing cost adapted to camera performances

For the iPhone 6 FaceTime camera module, Apple integrate an innovative CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub-microlenses array mediated by the color filters to get the final 1.2 Mpixel resolution. This technical choice has a strong impact on the camera performances and on the device manufacturing cost. The camera module of iPhone 6 Plus is the same as the one in the iPhone 6 and thus there is only one report.

The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module and a f/2.2 camera aperture which increase light sensitivity.

The report includes a comparison of Apple’s technical choices between iPhone6 Rear and Front camera.

iPhone 6 Front image


  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with iPhone 6 Rear camera CIS

Table of contents

Camera Module Supply Chain & Companies Profile

Physical Analysis

> Camera Module
     - Camera Module View & Dimensions
    - Camera Module X-Ray
    - Camera Module Disassembly
    - CMOS Image Sensor
    - View & Dimensions
    - Pads, Tungsten Grid
    - TSV Connections
    - CIS Pixels
    - Logic Circuit (Transistors, SRAM)
> Cross-Section: Camera Module
    - Overview
    - Ceramic Substrate, IR Filter & FPC
    - Lenses, Housing,
> Cross-Section: CMOS Image Sensor
    - Overview
    - Pad Trenches
    - Pixel Array Circuit
    - Logic Circuit
    - TSVs
> Comparison with iPhone 6 Rear Camera CIS
CIS Manufacturing Process Flow

> Global Overview
> Logic Circuit Front-End Process
> Pixel Array Circuit Front-End Process
> BSI + TSV + Microlenses Process
> CIS Wafer Fabrication Unit

Cost Analysis

> Synthesis of the cost analysis
> Main steps of economic analysis
> Yields Hypotheses
> CMOS Image Sensor Cost
    - Logic Circuit Front-End Cost
    - Pixel Array Front-end Cost
    - BSI & TSV Front-End Cost
    - Color Filters & Microlenses Front-End Cost
    - Total Front-End Cost
    - Back-End: Tests & Dicing
    - CIS Wafer and Die Cost
> Camera Module Assembly Cost
    - Lens Module Cost
    - Packaging Cost
    - Final Cost
> Camera Module Cost


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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