Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Apple iPhone 6 & 6 Plus Rear Camera Modules from Sony
Dec.2014

iphone 6 rear icon
3 490 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 39% on your package – Contact us!
+



Description

iPhone 6 rear flyerDiscover the innovations in the camera modules of Iphone 6 & 6 Plus: 45nm technology node / Optical Image Stabilizer integration/New Packaging


System Plus Consulting presents in two jointed reports the technological innovation integrated in Apple’s iPhone 6 & 6 Plus iSightcamera modules and their differences.

 Apple improves the logic ISP circuit, passing from 65nm to 45nm technology node process, and introduces the Optical Image Stabilization System, assembling it in a innovative way.

The iPhone 6 Plus  camera module integrates the 8Mpixel resolution CMOS Image Sensor, with aperture of f/2.2 and a pixel size of 1.5µm, in a new bigger and flexible packaging concept.

The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process and uses the unique technology from Sony (Exmor-RS). The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit. This allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity.

The two camera modules, slightly different in dimensions, are both equipped with a 5-elements lens module and a VCM auto-focus actuator. 

iPhone 6 rear image
COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with  iPhone 5S and Nokia Lumia technology choices
 

Table of contents

Camera Module Supply Chain & Companies Profile


Physical Analysis

> Camera Module
    - Camera Module View & Dimensions
    - Camera Module X-Ray
    - Camera Module Disassembly

> CMOS Image Sensor
    - View & Dimensions
    - Pads, Tungsten Grid
    - TSV Connections
    - CIS Pixels
    - Logic Circuit (Transistors, SRAM)

> Cross-Section: Camera Module
    - Overview
    - Driver (Assembly & Process) & MLCC
    - Ceramic Substrate, IR Filter & FPC
    - Lenses, Housing, VCM, IOS

> Cross-Section: CMOS Image Sensor
    - Overview
    - Pad Trenches
    - Pixel Array Circuit
    - Logic Circuit
    - TSVs

> Comparison with previous 8Mpixel CIS from Sony
CIS Manufacturing Process Flow

> Global Overview

> Logic Circuit Front-End Process

> Pixel Array Circuit Front-End Process

> BSI + TSV + Microlenses Process

> CIS Wafer Fabrication Unit


Cost Analysis

> Synthesis of the cost analysis

> Main steps of economic analysis

> Yields Hypotheses

> CMOS Image Sensor Cost
    - Logic Circuit Front-End Cost
    - Pixel Array Front-end Cost
    - BSI , IOS & TSV Front-End Cost
    - Color Filters & Microlenses Front-End Cost
    - Total Front-End Cost
    - Back-End: Tests & Dicing
    - CIS Wafer and Die Cost

> Camera Module Assembly Cost
    - Lens Module Cost
    - VCM Actuator Cost
    - Final Cost

> Camera Module Cost

 

SYSTEM PLUS CONSULTING

Discover the innovations in the camera modules of Iphone 6 & 6 Plus: 45nm technology node / Optical Image Stabilizer integration/ New Packaging

Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.