Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate.
The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit.
Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
Overview / Introduction
> Views and Dimensions > System Opening> Electronic board- Top side – Global view, high definition photo, components markings and identification- Bottom side – Other component identification
> Sealing Glue EDX Analysis> Sensor Unit Module Disassembly> NV3 Core Board> NV3 Personality Image Sensor> MicrobolometerBoard> Optical Element Cross-Section
> Accessing the BOM> PCB Cost and CIS Cost> BOM Cost – Electronic Board> BOM Cost – Image Sensor Board and Camera Module> Housing Parts – Estimation> BOM Cost - Housing> Material Cost Breakdown by Component Category> Accessing the Added Value (AV) cost> Electronic Board Manufacturing Flow> Details of the Electronic Board, System Assembly, Housing AV Cost> Manufacturing Cost Breakdown for 500k and 1M units
Estimated Price Analysis
> Package - Package views, dimensions, opening, wire bonding process, cross-section > Window- View, dimensions, cross-section, Au/Sn Eutectic bonding> Microbolometer- CIS view, dimensions, pixels, main blocks and cross-section> Illumination Module- View, dimensions and markings, active pixels, compensation pixels, cross-section, process characteristics> ROIC> Comparison
> MicrobolometerBoard>Optical Element Cross-Section
Manufacturing Process Flow
> ROIC Front-End Process> ROIC Wafer Fabrication Unit> Microbolometer Process Flow> Window Wafer Fabrication Unit> Packaging Process Flow
> ROIC> Microbolometer- MEMS front-end cost and cost by process step> Window> Component- Bonding front-end cost- IR sensor wafer and die cost- Back-end: final test cost- Microbolometercomponent cost
Estimated Price Analysis
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Comparison between FLIR and ULIS microbolometers, and with consumer products
Manufacturing process flow
Supply chain evaluation
Manufacturing cost analysis
Estimated sales price