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Bosch Sensortec BMA355 3-Axis MEMS Accelerometer
Jul.2014

image bosch bma3550 wlcsp mems 3-axis accelerometer v1
2 990 €

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Description

Flyer icone Bosch BMA3550 WLCSP MEMS 3-Axis AccelerometerDiscover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)

After being integrated in the latest Apple’s iPhone in 2013, Bosch is now the top MEMS supplier according to Yole’s Top 30 MEMS Ranking 2014. This strong growth is both due to the consumer and automotive businesses of Bosch.

With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling a WLCSP package. All the manufacturing steps are realized at the wafer-level. This is the first introduction of a MEMS component with TSV Via-Middle process.

The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.

The report is including a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.
Discover all the details in the report!

COMPLETE TEARDOWN WITH:

  •  Detailed Photos
  •  Precise Measurements
  •  Material Analysis
  •  Manufacturing Process Flow
  •  Supply Chain Evaluation
  •  Manufacturing Cost Analysis
  •  Selling Price Estimation
  •  Comparison with last  generation 3-Axis Acceleros


Image Bosch BMA3550 WLCSP MEMS 3-Axis Accelerometer

Table of contents

Glossary
Introduction, Bosch Sensortec Company Profile

Physical Analysis
> Package
- Package Views & Dimensions
- Package Opening
- Package Cross-Section (TSV, RDL)
> ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks Identification
- Process Identification
- Cross-Section
> MEMS Die
- View, Dimensions & Marking
- B ond Pad Opening
- Cap Removed & Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap & Sealing)
- Process Characteristics
> Consumer 3-Axis Accelerometer Comparison (Bosch Sensortec, STMicroelectronics and mCube)
Manufacturing Process Flow
> Global Overview
> ASIC Front-End Process & Wafer Fab Unit
> MEMS Process Flow & Wafer Fab Unit
> WLP Process Flow & Assembly Unit

Cost Analysis

> Yields Hypotheses
> ASIC FEOL & BEOL Cost
> ASIC TSV Cost
> ASIC TSV Cost per Process Steps
> MEMS Front-End Cost
> MEMS Back-End 0 : Probe Test & Dicing
> MEMS Front-End Cost per process steps
> MEMS Wafer & Die Cost
> Wafer-Level Packaging Cost
> Wafer-Level Packaging Cost per Process Steps
> Back-End : Final Test & Calibration Cost
BMA355 Component Cost

Estimated Price Analysis

Consumer 3-Axis Accelero Cost Comparison (Bosch Sensortec, STMicroelectronics & mCube)



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Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
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