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Bosch Sensortec BMC150 6-Axis MEMS eCompass
Mar.2014

bosch bmc150 emv
2 990 €

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Description

Bosch BMC150 icone flyer

Second Generation Electronic Compass, very low power consumption and tiny footprint (2.2x2.2mm²) thanks to an optimized integration

The BMC150 combines a 12-bit 3-Axis accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2x2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. The MEMS accelerometer is also an evolution of the one found in BMC050.

The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications.

COMPLETE TEARDOWN WITH:

Detailed Photos
Precise Measurements
Material Analysis
Manufacturing Process Flow
Supply Chain Evaluation
Manufacturing Cost Analysis
Selling Price Estimation

 

Photo Bosch BMC150 MEMS 6-Axis eCompass

Table of contents

Glossary
Overview/Introduction , Bosch Company Profile
Physical Analysis
> Package
- Package Views, Dimensions & X-Ray
- Package Opening
- Wire bonding Process
- Package Cross-Section
> Accelerometer ASIC Die
- View, Dimensions & Marking
- Process Identification
- Cross-Section
> Accelerometer MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed & Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap & Bonding)
- Process Characteristics
> Magnetometer Die
- View, Dimensions & Marking
- Hall sensor and fluxgate sensors
- Delayering
- Main Blocks Identification
- Cross-Section (CMOS & Sensor)

Manufacturing Process Flow

> ASIC Accelero Front-End Process
> MEMS Accelero Process Flow
> Magnetometer Process Flow
> Wafer Fabrication Unit
> Packaging Process Flow
> Package Assembly Unit



Cost Analysis
> Main steps of economic analysis
> Yields Hypotheses
> ASIC Front-End Cost
> ASIC Back-End 0 : Probe Test & Dicing
> ASIC Wafer & Die Cost
> MEMS Front-End Cost
> MEMS Back-End 0 : Probe Test & Dicing
> MEMS Wafer & Die Cost
> Magnetometer CMOS Front-End Cost
> Magnetometer Sensor Cost
> Magnetometer Sensor Cost per process steps
> Magnetometer Back-End 0 : Probe Test & Dicing
> Magnetometer Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Final Test Cost
> BMC150 Component Cost

Estimated Price Analysis




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