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Bosch Sensortec BME280 - Integrated Environmental Sensor

bme280 icone
2 990 €

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BME280 flyerHigh performances pressure and humidity sensor based on Bosch APSM process and innovative resistive measurement technology in a single compact package

Bosch BME280 environmental sensor is the evolution of BMP280 pressure sensor. Assembled in a 8-pins LGA 2.5 x 2.5 x 0.93mm package, the BME280 is a digital humidity, pressure and temperature sensor equipped with two MEMS dies and an amplification ASIC. It is designed by CMOS process and it has operating ranges of -40…+85°C, 0…100 % relative humidity and 300…1100 hPa.

The MEMS pressure sensor is manufactured with Bosch APSM process with the flexible pressure membrane and temperature diodes on Si substrate. The relative humidity sensors presents an innovative resistive measurement technology which allows a very fast and precise response in very compact size.
This device represents a new type of combo sensor for mobile phones: its open package is a quite new features respect to close packaged combos. In the report it is performed a exhaustive package analysis.
The report presents deep technological and cost analysis of BME280 and a technical comparison with BMP280 MEMS and ASIC and with Sensirion SHTC1 humidity MEMS.

BME280 img


  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • BME280 Vs BMP280 MEMS
  • BME280 Vs Sensirion SHTC1

Table of contents


Overview/Introduction , Companies Profile

Physical Analysis

> Package
  • Package Views & Dimensions
  • Package Opening
  • Wire bonding Process
  • Package Cross-Section
> ASIC Die
  • View, Dimensions & Marking
  • ASIC Delayering
  • ASIC main blocks identification
  • ASIC Process
  • ASIC Die Cross-Section
> Pressure & Humidity Die
  • View, Dimensions & Marking
  • MEMS Pressure Sensing Area
  • MEMS Humidity Sensing Area
  • MEMS Pressure Cross-Section: MEMS
  • MEMS Humidity Cross-Section
  • MEMSs processes

Comparison with BMP280 pressure sensor

Comparison with Sensirion SHTC1 humidity sensor
Manufacturing Process Flow

> ASIC Front-End Process
> MEMS Pressure Process Flow
> MEMS humidity Process Flow
> Wafer Fabrication Units
> Packaging Process Flow & Assembly Unit

Cost Analysis

> Main steps of economic analysis
> Yields Hypotheses
> ASIC Front-End Cost
> ASIC Back-End 0 : Probe Test & Dicing
> ASIC Front-End Cost
> MEMS Pressure Front-End Cost
> MEMS Pressure Back-End 0 : Probe Test & Dicing
> MEMS HumidityWafer & Die Cost
> MEMS HumidityFront-End Cost
> MEMS Humidity Back-End 0 : Probe Test & Dicing
> MEMS Pressure Wafer & Die Cost
> Back-End : Packaging Cost
> Back-End : Packaging Cost per Process Steps
> Back-End : Final Test & Calibration Cost
> BME280 Component Cost

Estimated Price Analysis



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