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Cavendish Kinetics 32CK417R MEMS Antenna Tuner

2 990 €

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Yole Cavendish flyerCavendish Kinetics 32CK417R MEMS Antenna Tuner Cavendish Kinetics revolutionizes the RF industry with its world first MEMS antenna tuner exhibiting extra small size (only 2mm2) and very low insertion losses

Cavendish Kinetics promises to revolutionize the RF stage in mobile phones with its MEMS tunable capacitor. The 32CKxxx family is optimized for the antenna tuning function. And Cavendish wants to use its SmarTune technology in RF filters and Tx antenna switch.

Today, these Cavendish Kinetics components are integrated in the Nubia Z7 and Z9 phones. With a very small footprint, less than 2mm², the 32CK417R is the smallest antenna tuner on the market. Moreover, the specific SmarTune technology offers a fine capability to tune the capacitor value, 32 steps between the min and max value to have a seamless tuning.

The report provides all details on the structure of the component and the supply chain to produce this astonishing MEMS. The 32CK417R integrates an ASIC to drive the variable capacitor and thanks to a SPI or MIPI bus communication facilitating the integration for phone manufacturers. The Wafer Level Packaging, from STATS ChipPAC, reduces the insertion loss, 5x lower than RF SOI solution. All the wafer manufacturing process, ASIC part and MEMS part, are performed by Tower Jazz. The report includes a detailed technology and cost analysis describing the innovations of Cavendish Kinetics and TowerJazz for this unique Antenna Tuner.

Yole Cavendish antenna img


  •  Detailed Photos
  •  Precise Measurements
  •  Material Analysis
  •  Manufacturing Process Flow
  •  Supply Chain Evaluation
  •  Comparison with Wispry MEMS Antenna Tuner
  •  Manufacturing Cost Analysis
  •  Selling Price Estimation

Table of contents

Overview / Introduction

Cavendish Company Profile

Physical Analysis

> Physical Analysis Methodology
  • Package Package Characteristics
  • Marking & Pin-out
  • Package Opening & Wire Bonding Process
  • Package Cross-Section
> MEMS Die
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Capacitor Area
  • Capacitor Cross-Section
  • Capacitor Delayering Process Characteristics

> ASIC Die

  • View, Dimensions & Marking
  • Delayering Main Blocks Identification
  • Cross-Section
 Manufacturing Process Flow

> Global Overview

> ASIC Front-End Process

> Tunable Capacitors Process Flow

> Wafer Fabrication Unit

> Packaging Process Flow

> Package Assembly Unit

Cost Analysis

> Synthesis of the cost analysis

> Main steps of economic analysis

> Yields Hypotheses

> ASIC Front-End Cost

> MEMS Front-End Cost

> MEMS Back-End 0 : Probe Test & Dicing

> MEMS Wafer & Die Cost

> Back-End : Packaging Cost

> Back-End : Packaging Cost per Process Steps

> Back-End : Final Test & Calibration Cost

> 32CK417R Component Cost

Price Analysis

> Cavendish Financial Results

> 32CK147R Selling Price Estimation



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

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− Custom reverse costing analyses: technology analysis followed by cost evaluation
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