Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
The system integrates two electronic boards. The MCU board includes a microcontroller from NXP Semiconductor. The RF board is manufactured with a symmetric structure using hybrid PTFE/FR4 substrate and is equipped with planar antennas. 24GHz SiGe monolithic microwave integrated circuits (MMIC) from Infineon are used as high-frequency transmitter and receiver.With this 3rd-generation short-range radar, Continental has reduced by 25% the total number of components used and significantly decreased the manufacturing cost, compared to the previous generation (SRR2).Based on a complete teardown analysis of the Continental SRR3-B, this report provides the radar sensor’s BOM and manufacturing cost.
Overview/Introduction
> Executive Summary
> Company Profile
> Reverse Costing Methodology
Physical Analysis
> Radar Global View
> Radar Views and Dimensions
> Radar Opening
> RF Chipset
> Electronic Boards
> MCU Board - Global view- High-definition photo- Component markings and identification
> RF Board - Global view- High-definition photo- Component markings and identification
Cost Analysis
> PCB Cost
> RF Board Cross-Section and EDX Analysis
> BOM Cost - MCU Board
> BOM Cost - RF Board
> BOM Cost - Housing
> Materials Cost Breakdown
> Accessing the Added-Value (AV) Cost
> MCU Board - Manufacturing Flow
> RF Board - Manufacturing Flow
> Details of the Housing Assembly & Functional Test Costs
> AV Cost Breakdown
> Manufacturing Cost Breakdown
Estimated Price Analysis
> Manufacturing Price Estimate
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Detailed photos
Materials analysis
RF chipset
PCBs cross-section
MCU physical analysis and cost estimate
Complete and priced bill-of-materials (BOM)
Manufacturing process flow
Manufacturing cost analysis
Estimated cost and sales price