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FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core

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Icone FLIR One and LEPTON 2nd Generation image

Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size

After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!

Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.

The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…

On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.

To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.

 FLIR One and LEPTON 2nd Generation full images

















Table of contents

FLIR One System -75 pages




Physical Analysis

> Package Opening
> Views and Dimensions of the Camera
> FLIR One Disassembly
> Shutter Disassembly
> Housing Disassembly
> Electronic Boards
  - Global View
  - Top & Bottom Sides HR Photos
  - Components Identification

Cost Analysis

> Cost of the PCBs
> Cost of Sonix Controller
> Electronic Boards BOM Cost
> Housing BOM Cost
> Packaging BOM Cost
> Material Cost Breakdown
> Electronic Boards Assembly Cost
> Housing Assembly Cost
> Assembly Cost Breakdown
> Manufacturing Cost Breakdown


Estimated Price Analysis

> Estimation of the Manufacturing Price


FLIR Lepton LWIR Module -185 pages




Physical Analysis

> Lepton Module
  - View, Dimensions & Pin-Out
  - Module Opening, Housing, Lenses
  - IR Sensor Assembly
> Lepton Module Cross-Section
  - Substrate, Heat Spreader, Lenses
> IR Sensor Die
  - View, Dimensions & Marking
  - Window Removed and Details
  - Pixel Area & Pixel Details
  - ROIC Delayering & Process
> IR Sensor Cross-Section
  - Overview, Sealing, Window
  - ROIC, Microbolometer
> ASIC Dies
  - View, Dimensions & Marking
  - Delayering & Process, Cross-Section


Manufacturing Process Flow

> ASICs, ROIC, µbolometer & Window
> Wafer Fab Units


Cost Analysis

> ASICs Wafer & Dies Cost
> ROIC, µbolometer & Window  Front-End Cost
> IR Sensor Wafer & Die Cost
> Lenses & Module Assembly Cost
> Lepton Module Cost


Estimated Price Analysis





















About the authors


Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses.

The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling. We offer:custom reverse costing analyses, standard reverse costing reports and costing tools within the following fields: integrated circuits, power devices and modules, MEMS & sensors, photonics (LED, Image Sensors), packaging and electronic boards and systems.



























































  • Detailed Photos (Optical & SEM)

  • Precise Measurements

  • Material Analysis (EDX)

  • Supply Chain Evaluation

  • Bill of Material

  • Manufacturing Process Flow

  • Manufacturing Cost Analysis

  • Selling Price Estimation

  • Comparison with Seek Thermal, Therm-App and FLIR One 1st Ge