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FLIR Systems FLIR ONE & LEPTON Consumer Thermal Imager with Microbolometer

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3 990 €

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FLIR ONE flyerThe first consumer thermal camera featuring the world's smallest microbolometer-based thermal imaging camera core.

Initially focused on the Military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, FLIR drive the commercial market’s price war.

Plugged into the back of an IPhone 5 or 5S, the FLIR ONE is the first consumer thermal camera featuring Long Wave Infrared (LWIR) technology. It contains a visible VGA (640x480) camera and a thermal camera which provide images blended using FLIR MSX Technology.

The thermal camera uses a new core, LEPTON, featuring a 80x60 pixels resolution with pixel size of 17µm. The sensor technology in the LEPTON core is an uncooled VOx microbolometer. Thanks to its strong integration at the core level with innovative wafer-level optics (WLO), wafer-level packaging (WLP) and custom ASIC use, this is the world's smallest microbolometer-based thermal imaging camera core.

Based on complete teardown analyses of the FLIR ONE and the LEPTON core, the reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
The report also includes a comparison with FLIR i7 infrared camera and sensor, highlighting the technical choices made by FLIR to decrease by more than three the manufacturing cost at the camera level and the sensor level to made a consumer product.


  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with FLIR i7 infrared camera and microbolometer sensor

Table of contents


Overview/Introduction, FLIR Company Profile, Main Features

Physical Analysis

  • Packaging
  • Views and Dimensions of the Housing
  • FLIR ONE Disassembly
  • Main Board
    • High Definition Photos & PCB Markings
    • Components Markings & Identification
  • USB Board
  • Sonix PC Camera Controller Analysis

Cost Analysis

  • Accessing the BOM
    • Estimation of the cost of the PCBs
    • Estimation of the Cost of the Lepton Camera Module
    • Estimation of the Cost of the Sonix Camera Controller
    • BOM Cost – Electronic Boards, Housing and Packaging
    • Material Cost Breakdown
  • Accessing the Added Value (AV) Cost
    • Main Board Manufacturing Flow & AV Cost
    • USB Board Manufacturing Flow & AV Cost
    • Housing & Packaging Assembly AV Cost
    • Added Value Cost Breakdown
  • Estimation of the Manufacturing Price
LEPTON Infrared Camera Module

Overview/Introduction, Company Profiles, Main Features

Physical Analysis

  • Camera Module
    • View & Dimensions
    • Disassembly & Cross-Section
  • ASIC
    • View & Dimensions
    • Delayering & Main Blocks Identification
    • Cross-Section & Process Characteristics
  • Infrared Sensor
    • Microbolometer & ROIC Views & Dimensions
    • Pixel Details, Delayering
    • Cross-Section & Process Characteristics
Manufacturing Process Flow

  • ROIC Process & Microbolometer Process Flow
  • Wafer Fabrication Unit

Cost Analysis

  • Yield Hypotheses
  • ROIC & Microbolometer Front-End Cost
  • Wafer & Die Cost
  • Camera Module Assembly Cost
  • LEPTON Camera Module Cost & Price



Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

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