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FOWLP Patent Analysis
Aug.2012

top 10 patent assignees fowlp patents
2 990 €

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Description

Yole FOWLP Patent 2012Adopted for both mobile phone and consumer electronics applications, Fan-Out Wafer Level Packaging (FO-WLP) is the most innovative, advanced packaging technology today. Analysing patent status is the key to understanding the business situation.

ANALYSIS OF THE PATENT PORTFOLIO’S TECHNICAL CONTENT


After several years of specific analysis for customers, Yole Développement has decided to publish its first analysis concerning the technical contents of patents. This first study focuses on the FO-WLP area, a new packaging technology which is changing the patent landscape for semiconductor packaging across a wide range of application spaces. Yole Développement has developed a specific methodology to conduct this analysis (described below), mixing our technical and business knowledge with classical access to the patent database.

A FEW COMPANIES WITH MANY PATENTS, MANY COMPANIES WITh A FEW PATENTS

A complex patent landscape: 10 companies dominate the FO-WLP IP space, but more than 120 organizations have patents in this field, representing 232 relevant patent families and 231 related patent families (in total, Yole Développement has identified more than 1,000 patents). This analysis provides an Excel file database of all relevant patents, enabling a multi-criteria search. The criteria are the same as those used for the technological segmentation:

  • Patent information
    • Patent publication number
    • Title
    • Abstract
    • Assignee/applicant
    • Inventors
    • Priority date
    • Patent family relationships
  • FOWLP structure criteria
    • FOWLP toolbox detail or improvement (die placement, bonding, encapsulation, carrier
    • de-bonding, passivation, RDL, bumping,singulation)
    • Additional elements to the original process
  • Chip orientation
  • Carrier shape
  • Architecture details
    • 2D structures
    • MCP
    • 3D structures
    • PoP
    • PiP
    • Stacked dies
    • Use of vertical interconnects
    • TSV
    • TMV
    • Technology used
    • eWLB
    • RCP
    • PBP
    • Other
  • Packaged devices

Top 10 patent assignees FOWLP patents
It is also interesting to note the varying size of the players involved in this area.We find large companies like TSMC, as well as start-up /small players like Megica.The FO-WLP IP space was studied from several different angles, and our analysis provides information regarding patents filed by every kind of player, including the most recent assignees.
 
This complete description of the patent landscape is included in the first part of the analysis, and provides all the background materials for the FO-WLP patent landscape analysis.The analysis provides a complete summary of the patent landscape, including the patents’ geographic origins, company or R&D organizations that were granted the patents, historical data on when the companies applied for patents in the last 20 years, the patent inventor(s), expiration status, R&D collaborations,and more.

Yole Embedded Evolution of top 15 priority July 2013
DETAILED ANALYSIS OF THE TOP10 FO-WLP PATENT ASSIGNEES

The analysis also offers an in-depth look at the patent portfolio of each of the TOP 10 patent assignees, including Infineon, ACE, Tessera, Samsung, Freescale, StatsChipPac, ASE, Amkor and STMicroelectronics.
For each of these companies, the analysis provides a comprehensive study of the patent portfolio, highlighting the following points:

  • Company patent portfolio evolution
  • Countries of deposition and patents’ origin
  • Top inventors
  • Process flow developed by the company (for commercially available devices)
  • Technical segmentation of each patent portfolio
  • Patent portfolio analysis for each manufacturing process step and architecture
  • Main technical innovations
  • Which patents are used in production today, and which patents exist to prepare the future generation of FO-WLP technologies (multi dies,panel scale FO-WLP, PoP FO-WLP, TMV, etc.)
  • Remaining challenges for the company from Yole Développement’s perspective
In addition, the analysis highlights the strengths and weaknesses of each company’s patent portfolio and the developments currently implemented by each company.
new architectures using FOWLP tecnology

UNIQUE TECHNOLOGICAL ANALYSIS OF THE PATENT CONTENT AND IDENTIFICATION OF KEY PATENTS

Based on Yole Développement’s analysis of the technology trends in FO-WLP, the R&D of all worldwide players, and the teardown of the devices in production, we were able to identify and analyze the most important innovations for each process step of FO-WLP, from die placement and encapsulation to passivation and bumping. For each FO-WLP process step, the analysis provides the related patents and the evidence of its use in real devices, taking full benefit of the teardown analysis provided by our partner, System Plus Consulting.
For example, a strong focus is placed on Infineon’s eWLB technology, as well as on the 2nd generation FO-WLP patents describing new architectures using the eWLB solution (please see the full reverse analysis carried out by System Plus Consulting, titled “Infineon Fan-out WLP Reverse Costing Analysis”). As a synthesis, the analysis ranks the most important patents, highlights which of the analyzed documents are blocking, identifies which company owns such patents, and reviews the content of each patent.

Example of FOWLP Process Flow reconstitution
A UNIQUE METHODOLOGY OF ANALYSIS

Based on requests to Micropatent,Yole Développement has developed a unique methodology (described in the sample) for defining a technical segmentation of the patent landscape, and determining which patents are the most innovative, either for future implementation or for use in current production. By mixing its technical knowledge, business acumen and patent research, Yole Développement is able to provide unique evaluation and added value via this analysis.

Table of contents

Introduction
Methodology for patent screening and analysis
Objectives of this report
Search strategy for FOWLP IP analysis
FOWLP roadmap
IP landscape analysis:
> TOP 10 patent assignees for FOWLP technologies
> Landscape overview in 2012
> Evolution of the major assignees for FOWLP
> Recent assignees for FOWLP
> Top Inventors
> Top academics and R&D centers
> FOWLP WIPO application status
> Legal status distribution of all relevant patents
> FOWLP patents expiration status
> Main collaborations
> List of all assignees (125 companies)
Analysis of the FOWLP pa tents filed by the key players:
> For each company, the following analysis has been done
> Company profile
> Patent evolution in the last 10 years
> Description of the technology under development or in production
> Process flow and related patent currently used
> Countries of deposition
> Top inventors
> Patent mapping and analysis per process steps and new architectures
> Companies included in the analysis:
- ACE
- Amkor Technologies
- ASE
- Freescale
- Infineon
- Samsung
- ST
- Statschippac
- Tessera
 Key patent analysis
> Methodology used for the identification
> Identification of the key patents
> Description and analysis of each of the key patent
> Specific analysis of the new FOWLP architectures
Cross link analysis
Conclusion & appendix

Companies cited

Advanced Chip Engineering(ACE)
Infineon Technologies
Samsung
STATS ChipPac
Tessera
Advanced Semiconductor Engineering(ASE)
Freescale
Semiconductor
MicronTechnology
Megica
Qimonda
Amkor Technology
Taiwan Semiconductor Manufacturing Corp(TSMC)
STM
Fujitsu
Hynix Semiconductor
Agency For Science Technology & Research(ASTAR)
Broadcom
NXP
Renesas Electronics
Xintec
Hitachi
Sony
Analog Devices
FlipChip Technologies
IMEC
Jiangyin Changdian Advanced Packaging(JCAP)
MediatekInc
Motorola
NipponSteel
United Microelectronics Corp(UMC)
Advanced Interconnec tSolutions
Advanced MicroDevices
ChipMOS Technologies
IBM
Industrial Technology Research Institute(ITRI)
King Dragon International
NationalHybrid
Nepes
Schott
Semiconductor Manufacturing International Corp(SMIC)
Shinko Electric Industries
Siliconware Precision Industries
Sumitomo
Bakelite
Toyota Industries
Unisem Holdings
Visera Technologies
Yamaha
Yupei Technology
Agilent TechnologiesInc
Altera
Apic Yamada
Aptina Imaging Corporation
Atmel
Cambridge Silicon Radio
Casio Computer
China WLCSP
Chipbond Technology Corporation
Cypress Semiconductor
Daimler Benz
Deca Technologies
Easetech Korea
Epic TechnologiesInc
Epworks
Express Packaging
Systems
Fairchild Semiconductor
Fineart Technology
Formfactor
Fujikura
Georgia Tech Research
Ibiden
Invensas
IPdia
KingstonTechnology
Kyocera Chemical
LSILogic
Marvell
Maxim Integrated Products
MicroasiInc
MijiElectronic
Mitsubishi Electric
NanonexusInc
National University Of Singapore
NEC Electronics
Oerlikon
Panasonic
Petari Incorporation
Philips
Powertech Technology
Princo
PrismaFibers
Qualcomm
Ricoh
Salmon Technologies
Sharp
Silicon Storage Technology
Texas Instruments
Thin Film
Module
ToppanPrinting
Toray Advanced Materials Korea
Toshiba
Triquint Semiconductor
Tsinghua University
UltratechInc
Universiteit Gent
US National
Institutes of Health(NIH)
Verigy(Singapore)PteLtd
Waters Technologies
WestinghouseElectric

 

KEY FEATURES OF THE REPORT

The report provides:

  • Presentation of the industrial and business status of the FOWLP today
  • Definition and delivery of a database of all the relevant patents with technological segmentation
  • Detailed architecture to be implemented
  • Identification of key patents and their owners
  • Linking available patents with what is currently being implemented in production[/features]