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Freescale FXTH87- Tire Pressure Monitoring Sensor (TPMS)

freescale tpms icon
2 990 €

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Freescale TPMS flyerThe TPMS solution featuring the smallest footprint and lowest RF power consumption

Pressure sensor market growth is mainly driven by TPMS due to legislation and quick adoption around the world. Freescale is competing head to head with Infineon on this application.
The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest footprint with 7x7mm², the smallest RF power consumption with 7mA Idd and the largest customer memory size with 8kB flash. In the report we make a comparison with Infineon SP37 device in order to understand the technologies differences and highlight each cost structures.

This system in package includes a dual-axis accelerometer (XZ), pressure and temperature sensors, an integrated MCU, a RF transmitter and a low frequency receiver. It is 40% smaller than Freescale’s previous-generation QFN 9x9mm package and 50% smaller than Infineon SP37 TPMS solution .

The pressure sensor is based on Freescale’s MEMS capacitive pressure cell without signal conditioning. The accelerometer included in the FXTH87 can be a single axis (Z) or a dual axis (XZ) and is manufactured with Freescale’s surface micromachining poly-Si MEMS process.

Assembled in a Film-Assisted Molding (FAM) 7x7mm QFN package with gel fill, the FXTH87 is certified AEC-Q100 and qualified for operating temperature range from -40°C to +125°C.

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  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with Infineon SP37
  • Analysis of generation evolution of Freescale TPMS devices

Table of contents

Overview/Introduction, Freescale

Company Profile

Physical Analysis

  • Package Views & Dimensions
  • Package Opening & Wire Bonding Process
  • Package Cross-Section
> ASIC Die
  • View, Dimensions & Marking
  • Delayering & Main Blocks Identification
  • Cross-Section & Process Characteristics
> MEMS Pressure Sensor Die
  • View, Dimensions & Marking
  • Sensing Area Details
  • Cross-Section & Process Characteristics
> MEMS Accelerometer Die
  • View, Dimensions & Marking
  • Cap Opening & Cap Details
  • Sensing Area Details
  • Cross-Section & Process Characteristics
> Freescale TPMS Evolution (Gen 2, 3 & 4)
> Comparison with Infineon SP37
Manufacturing Process Flow

ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Pressure Sensor Process Flow
MEMS Accelerometer Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow & Assembly Unit

Cost Analysis

Yields Hypotheses
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test & Dicing
ASIC Wafer & Die Cost
MEMS Pressure Sensor Front-End Cost
MEMS Pressure Sensor Cost per process steps
MEMS Pressure Sensor Wafer & Die Cost
MEMS Accelerometer Front-End Cost
MEMS Accelerometer Cost per process steps
MEMS Accelerometer Wafer & Die Cost
Back-End : Packaging & Final Test Cost
FXTH87 TPMS Component Cost & Price
Cost Comparison with Infineon SP37



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