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Glass Substrates for Semiconductor Manufacturing

yole fullreportbiophotonics april 2013 illustration the glass substrate markets overall
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YOLE GlassSubstrates 2013The glass wafer market will reach more than 15M 8” EQ WSPY by 2018, driven by 2.5D interposer and carrier wafer functionalities.

Glass is everywhere: from MEMS, CMOS image sensors and power to memory, logic IC and microfluidicS

Glass is widely used in everyday life and found in large quantities in many industries, such as flat panel display applications. Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution.
The application scope of glass substrates in the semiconductor field is broad and highly diversified.

This report covers the following end-applications and functionalities:
  • End-applications: MEMS, CMOS Image Sensors, LED, Memory, Logic IC, RF/Analog ICs, Power, μbatteries, Optoelectronic components, Microfluidics
  • Functionalities: Support Substrate, WLCapping, 3D TGV/2.5D Interposer, Carriers, Microstructuring

The demand for glass is growing, and glass has already been adapted for various and unique wafer-processing functionalities and platforms supporting a wide range of end-applications. For example, WLCapping is driven mainly by MEMS and CMOS Image Sensors. In the coming years, the availability of other glass functionalities such as 3D TGV/2.5 D interposer in conjunction with end-applications like memory and logic IC will be the driving force for growth, creating new challenges and new technical developments along the way.

This report provides a detailed overview of glass’s functionality (or platform) aspects, as well as the various end-applications it’s relevant for.

Yole FullReportBiophotonics April 2013 Illustration Functionalities of glass substrateMainly driven by the Wafer-Level Packaging industry, the glass wafer market is expected to gr ow from $158M in 2012 to $1.3B by 2018, at a CAGR of ~41% over the next five years.

Initially driven by CMOS Image Sensor and MEMS applications, this growing industry will be supported by relevant end-applications such as LED, memory and logic IC, where glass is on its way to being commercialized. In terms of wafers shipped, a 4x glass wafer growth is expected in the semiconductor industry over the next five years, achieving more than 15M 8” EQ WSPY by 2018.
This report offers a detailed forecast of the glass substrate market’s next five years by end-application.

Glass substrate: a key enabler of various functionalities in the semiconductor field
Yole FullReportBiophotonics April 2013 Illustration The glass substrate markets overall
 The glass WLCapping platform is a mature functionality already adopted with significant volume in CMOS Image Sensors, where more than 3.3M glass caps were shipped in 2012. This market is expected to grow slowly, with a CAGR of 14% from 2012-2018, mainly supported by MEMS devices impacted by the request for further miniaturization. On the flip side, the glass market for WLOptics will likely decline from 2015-2018 due to the development of competing technologies.

All of this said, we expect to see strong growth in the glass market, mainly supported by two emerging WLP platforms:

With a CAGR of 110% and 70% respectively, the glass-type 2.5D interposer emerging platform and the carrier wafer will be glass’s fastest-growing fields over the next five years, since glass offers the best value proposition in terms of cost, flexibility, mechanical rigidity and surface flatness.

If glass is qualified for 2.5D interposer functionality, the glass market could exceed $1B revenue by 2018. However, it’s still unclear how BEOL wafer fabs will choose glass over the current silicon technology used for logic IC applications (for the 2.5D/3D SOC and system partitioning areas), but the glass variety of 2.5D interposer substrates is expected to significantly impact future glass wafer demand, and it’s obvious that the 2.5D Glass interposer will attract many newcomers.

The use of glass interposers in packaging will certainly be on the HVM roadmap within a few years.

This report delivers an overview of glass substrate’s technology trends and functionalities in the semiconductor industry.

Glass substrate: The top five players hold almost 80% of the market

In the semiconductor industry, the glass substrate market is split amongst five main suppliers. Schott (G), Tecnisco (JP), PlanOptik (G), Bullen (US) and Corning (US) will share more than 70% $158M glass substrate market this year, driven mainly by demand for WLCapping.

In the midst of this growing market, semiconductor glass suppliers are trying to differentiate themselves by proposing a variety of glass substrate material properties with a good CTE, solid thermal properties and no polishing/grinding steps required, which would result in reduced costs.

Yole FullReportBiophotonics April 2013 Illustration 2012 overall glass substrate market Many glass substrate suppliers such as AGC, Corning and HOYA are expected to increase their business in the next few years since they are quite aggressive in 2.5D interposers and glass carrier wafers, and are expected to ramp-up into high volume production. Since the big players are already deeply entrenched in the glass market, it will be very challenging for a new entrant to break through in the foreseeable future.

This report provides a summary of key glass substrate suppliers and examples of the main supply chain end-applications.

Table of contents


Table of contents 2
Glossary 3
Report scope 4
Companies cited in the report 5
Executive summary 7
> Glass wafer market forecast (in $M, wspy) 
> Breakdown by functionality 
> Breakdown by end-application 
> Breakdown by wafer size 
> Glass substrate players’ market share and revenue 

Introduction, definitions & report scope 32
2012-2018 glass wafer market status & evaluation breakdown by end-application 44
> Glass substrate market forecast (in wspy) 
- 2012 shipment forecast
- 2018 shipment forecast
> Glass substrate market forecast (in $m) 
- 2012 revenue forecast
- 2018 revenue forecast

Detailed glass market forecast by end-application 
> MEMS application opportunities 
> CIS application opportunities 
> RF/analog IC opportunities 
> LED application opportunities 
> Memory opportunities 
> Logic IC opportunities 
> Power opportunities
> Optoelectronic component opportunities 
> μbattery opportunities 
2012-2018 glass wafer market status & evaluation: breakdown by function/platform 128
> Glass substrate market forecasts (in wspy) 
- 2012 shipment forecast
- 2018 shipment forecast
> Glass substrate market forecasts (in $m) 
- 2012 revenue forecast1
- 2018 revenue forecast

Detailed glass market forecast by function/platform 146
> Focus on support substrate 
> Focus on WLCapping 
> Focus on WLOptics 
> Focus on 3D TGV/2.5D interposer 
> Focus on carrier 
> Focus on microstructuring 

Glass Substrate Wafer: Supply Chain & Value Chain 269
Main Players involved in Glass Substrate Processing 263
Glass Substrate Players’ Market Share and Revenue 266
Structuration of Glass Substrate 273
Wafer-Level Packaging Applications: Supply Chain for Memory & Logic IC 276
> Supply Chain for MEMS Devices 
> Supply Chain for CMOS Image Sensors 
> Supply Chain for Microfluidic Devices 

Glass Substrate Micromachining Technologies 302
Conclusions & Perspectives 217

Companies Cited


Berliner Glass
Boehringer Ingelheim
Microfluidic ChipShop
SK Hynix
Texas Instruments



  • Key technical insight into glass substrate’s future technology trends & challenges
  • Supply chain analysis of key endapplications using glass
  • Glass substrate market metrics (wspy and value)[/features]