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Heimann Sensor 32 x 32-Array Thermopile LWIR Image Sensor with Silicon Lens

3 490 €

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SP18396 Heimann Sensor HTPA32x32d Thermopile couv flyerA small, easy to use, low-power, cheap non-contact temperature measurement for varying applications.

LWIR imaging is increasingly used in myriad applications, from consumer to industrial. Low-cost, large arrays (32 x 32 and more) are specifically adapted to smart home/smart building applications for occupant detection, popu-lation localization, population counting, fire detection, and more. For these large markets of many hundreds of millions units a year, thermopile sensors are cost-competitive compared to micro-bolometers.


SP18396 Heimann Sensor HTPA32x32d Thermopile 2

Based on a low-definition, 32 x 32 thermopile sensor, Heimann Sensor’s HTPA32x32d is dedicated to these markets. Cheaper than a microbolometer and easier to integrate, the thermopile offers very good performance for applications that do not require high-resolution images and a high frame rate.

The thermopile array sensor consists only of a 0.5cm³ camera (with lens). The system is made easy for integrators with a digital I²C interface, and includes for the first time a silicon lens for low-cost applications. The 32 x 32 array sensor uses a 90µm pixel based on a thermopile technology for a very compact design.

This report provides a detailed teardown and cost analysis of the thermopile die, the silicon lens, the EEPROM die, and the packaging.

This report also includes a comparison between the characteristics of the new and previous versions of the thermopile sensors from Heimann Sensor, and a comparison with FLIR’s ISC1403 microbolometer. This latter comparison highlights differences in each company’s technical choices.


   SP18396 Heimann Sensor HTPA32x32d Thermopile 1                 SP18396 Heimann Sensor HTPA32x32d Thermopile 3















Table of contents

Overview / Introduction

Executive Summary

> Reverse Costing Methodology



Company Profile

Heimann Sensor



Physical Analysis

Synthesis of the Physical Analysis
> Physical Analysis Methodology
> Package
- Package views, dimensions and marking
- Package opening
> Silicon Lens
- View, dimensions
- Cross-section and lens coating
> Thermopile Die
- View, dimensions and marking
- Pixels, thermocouples
- Cross-section
- ROIC characteristics
- Process characteristics


Comparison - Heimann Sensor HTPA32x32d vs. Flir ISC1403L









































Manufacturing Process Flow

> Global Overview
> EEPROM Front-End Process and Wafer Fabrication Unit
> ROIC Front-End Process and Wafer Fabrication Unit
> Thermopile Front-End Process and Wafer Fabrication Unit
> Thermopile Back-End 0: Probe Test and Dicing
> Silicon Lens Front-End Process
> Back-End - Final Test



Cost Analysis

 > Synthesis of the Cost Analysis
> Yields Explanation and Hypotheses
- EEPROM die - front-end cost + Wafer and die cost
- Silicon lens - front-end cost + Wafer and die cost
- Thermopile die - front-end cost + wafer and die cost
> Component
- Back-end - packaging cost
- Back-end - final test cost
- Component cost



Estimated Price Analysis



































About the authors


System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

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  • Detailed photos

  • Precise measurements

  • Materials analysis

  • Comparison between Heimann Sensor and Flir Microbolometer

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Estimated sales price