Secure payment on i-micronews Contact Yole Développement for I Micronews reports

RSS I-micronewsYole Dévelopement on TwitterYole Développement on Google +LinkedIn Yole pageSlideshare Yole Développement I-Micronews

Huawei Ascend Mate 7 Fingerprint Sensor Fingerprint Cards FPC1020
Apr.2015

huawei fingerprint icone
2 990 €

Choose a minimum of three reports from Yole Group and receive a discount of at least 39% on your package – Contact us!
+



Description

Huawei Fingerprint flyerFingerprint Cards integrates in Huawei’s product the first smartphone fingerprint sensor based on capacitive sensing technology.

Huawei’s technological choice for the fingerprint sensor is going to the opposite direction than Apple’s and Samsung’s one. The Ascend Mate 7 presents an innovative fingerprint sensor developed by Fingerprint Cards, a main actor in capacitive sensing human interface solutions for consumer electronics companies.

The technical choice of Fingerprint Cards is totally different form the other’s. The fingerprint device is much more bigger and more expensive than its competitors (2.5 factor) to guarantee a better image quality. It presents a new sensing device design and structure; an innovative packaging and a different supply chain model.

The fingerprint sensor of the Ascend Mate 7 is located on the back side of the telephone and it has the dimension of 16.33x15.8 mm. The sensor is assembled on LGA packaging and incorporated within a rectangular shaped housing composed of an aluminum ring and plastic ring. Huawei Fingerprint imgThe report presents a detailed analysis of fingerprint structure and cost and a comparison with the Apple’s iPhone5 and Samsung’s Galaxy S5 fingerprint sensors.

COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain description
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with Apple’s and Samsung’s fingerprints
 

Table of contents

Glossary

Overview/Introduction
  • Executive Summary
  • Reverse Costing Methodology


Company Profile
  • Fingerprint Cards


Physical Analysis
  • Synthesis of the Physical Analysis
  • Ascend Mate 7 Fingerprint disassembly
  • Fingerprint Scanner Views
  • Fingerprint Scanner Croos-Section
  • Fingerprint Scanner Patents
  • Sensor Die View & Dimensions
  • Sensor Die marking
  • Sensor Die Capacitors
  • Sensor Die Edge Contact
  • Sensor Delayering & main Blocs
  • Sensor Die Process
  • Sensor Die Cross-Section
  • Sensor Die Process Characteristic
Sensor Manufacturing Process
  • Sensor Die Front-End Process
  • Sensor Die Front-End Wafer Fabrication Unit
  • Packaging Process
  • Packaging Fabrication Unit
  • Synthesis of the main parts


Cost Analysis
  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Explanation
  • Yields Hypotheses
  • Sensor Die Wafer Cost
  • Sensor Die Cost


LGA Packaged Component
  • LGA Packaging Cost
  • Components Cost


Fingerprint Module Cost
  • Components Cost
  • Fingerprint Sensor Assembly Cost

Huawei’s vs Samsung’s vs Apple’s fingerprint sensor comparison

 


SYSTEM PLUS CONSULTING


Across the Enterprise, from marketing to purchasing and R&D, product manufacturing cost is a major factor which has to be measured and then optimized. Since 1993, System Plus Consulting’s mission has been to develop and sell the right tools and services to meet these costing requirements.

System Plus Consulting utilizes an engineering approach to cost. Cost models and technology expertise are combined to provide customers with an accurate and objective estimation of manufacturing costs and selling prices.

Headquartered in Nantes, France, System Plus Consulting is specialized in technology and cost analysis of electronic components and systems. During our 20 years in business, we have built and refined detailed cost models as the primary tools for hundreds of analyses. The highly qualified System Plus cost engineers combine broad and deep skills in semiconductor and electronics technologies with years of experience in cost modeling.

We offer:
− Custom reverse costing analyses: technology analysis followed by cost evaluation
− Standard reverse costing reports: regular publications on innovative products (available from our catalogue)
− Costing tools: software tools combining models and data to perform cost analysis

System Plus Consulting analyzes any type of electronic devices and systems, with a special focus on semiconductor technologies. Major fields of technology and cost expertise are:
− Integrated Circuits
− Power Devices and Modules
− MEMS & Sensors
− Photonics: LED, Image Sensors
− Packaging including wafer level
− Electronic Boards and Systems

Our analyses are used by Purchasing Departments to measure their suppliers’ cost structure, R&D Departments to confirm technological choices depending on their impact on costs, and Benchmarking/Marketing Departments to monitor the products on the market.

System Plus Consulting is committed to provide a high level of service:
− Delivery of reports and custom analyses with a minimum lead time.
− Results presentation and online Q&A sessions when support is needed.
− Open methodology and full confidentiality in order to maintain a trustful collaboration.

Since 2008, our partnership with YOLE Développement has allowed us to stay at the forefront of technologies and has added a market view to our reports.

For more information, please click here.