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Infineon FF400R07A01E3 Double Side Cooled IGBT Module
Jan.2018

3 490 €

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Description

Couv Infineon double side cooling IGBT module System Plus ConsultingDiscover Infineon‘s first double sided cooling power module for automotive

Pushed by aggressive legislation, CO2 emission reduction is one of the key challenges in the 21st century. Therefore, carmakers need to develop cleaner vehicles. To achieve these ambitious targets, the best solution currently available is the electrification of vehicles, with different levels of electrification depending on the strategies of different car manufacturers. The full hybrid electric vehicle (HEV) segment will drive the IGBT power module market in the automotive industry, with IGBT power modules used for electric vehicles and hybrid electric vehicles (EV/HEV), competing with superjunction (SJ) MOSFETs . The IGBT market for EV/HEV reached $845M in 2016, making it the biggest IGBT market by value. However the market for IGBTs in the EV/HEV sector is expected to be worth almost $2.1B by 2022, representing over 41% of the whole IGBT market’s value.

Infineon double side cooling IGBT module System Plus Consulting

In a compact car the maximum power of the motor is 60kW, while the hybrid systems used in medium and large vehicles have inverter power exceeding 160kW. But when converting an existing petrol vehicle to a hybrid version, the available space in the engine compartment is often so limited that it is difficult to accommodate a Power Control Unit (PCU). Thus, it is necessary that the PCU, which controls the traction motors of HEVs, get smaller, with higher power density.

To achieve these targets, manufacturers have developed different solutions, such as reducing wire bonding or using a double-sided cooling (DSC) structure to efficiently cool the power semiconductor chips.

The HybridPACK Double Sided Cooled (DSC) power module is the first DSC IGBT module from Infineon specifically designed for automotive inverters. The FF400R07A01E3 drives 700A and uses a molded structure optimized for cooling, thus improving its thermal cycling capability and extending the lifetime of the power module.

The terminals are connected directly on the DBC with wire bonding and the dies are dissipated on the front side by alloy spacers.

The IGBT is manufactured with the standard TrenchStop technology design, which reduces losses in conduction and switching. The module uses an EMCON PN diode.

Based on a complete teardown analysis, the report also provides an estimation of the production cost of the IGBT, diode and package. The report also contains a technical and cost comparison between Infineon’s design and the Toyota Prius inverter’s DSC power module. It highlights the differences in design of the packaging and the material solutions adopted by the two companies.

 

 

 

 

 

 

 

 

 

 

 

Table of contents

Overview/Introduction


> Executive Summary

> Reverse Costing Methodology


Company Profile


> Infineon

Physical Analysis


> Overview of the Physical Analysis

> Package Analysis

- Package opening

- Package cross-section

> IGBT Die

- IGBT die view and dimensions, process, cross-section and process characteristic

> Diode Die

- Diode die view and dimensions, process, cross-section and process characteristic

 

Manufacturing Process


> IGBT die front-end process

> IGBT die fabrication unit

> Diode die front-end process

> Diode die fabrication unit

> Final test and packaging fabrication units

 





 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cost Analysis 


> Overview of the Cost Analysis

> Yield Explanations and Hypotheses

> IGBT Die

- IGBT die front-end cost

- IGBT die probe test, thinning and dicing

- IGBT die wafer cost

- IGBT die cost

> Diode Die

- Diode die front-end cost

- Diode die probe test, thinning and dicing

- Diode die wafer cost

- Diode die cost

> Complete Device

- Packaging cost

- Final test cost

- Component cost

 

Price Analysis


> Overview of the Cost 

 

Comparison


> Comparison with Toyota Prius Power Module

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

  

 

 

 

 

 

 

 

 

 

 


About the authors

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting specializes in the cost analysis of electronics, from semiconductor devices to electronic systems.

Created more than 20 years ago, System Plus Consulting has developed a complete range of services, costing tools and reports to deliver in-depth production cost studies and estimate the objective selling price of a product.

System Plus Consulting engineers are experts in:

  • Integrated Circuits 
  • Power Devices & Modules 
  • MEMS & Sensors
  • Photonics 
  • LED 
  • Imaging 
  • Display 
  • Packaging 
  • Electronic Boards & Systems.

Through hundreds of analyses performed each year, System Plus Consulting offers deep added-value reports to help its customers understand their production processes and determine production costs. Based on System Plus Consulting’s results, manufacturers are able to compare their production costs to those of competitors.

System Plus Consulting is a sister company of Yole Développement.

More info at www.systemplus.fr 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

REVERSE COSTING WITH

  • Detailed photos

  • Precise measurements

  • Material analysis

  • Manufacturing process flow

  • Supply chain evaluation

  • Manufacturing cost analysis

  • Selling price estimation

  • Comparison with Toyota Prius power module